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1===================================
2Generic Thermal Sysfs driver How To
3===================================
4
5Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
6
7Updated: 2 January 2008
8
9Copyright (c) 2008 Intel Corporation
10
11
120. Introduction
13===============
14
15The generic thermal sysfs provides a set of interfaces for thermal zone
16devices (sensors) and thermal cooling devices (fan, processor...) to register
17with the thermal management solution and to be a part of it.
18
19This how-to focuses on enabling new thermal zone and cooling devices to
20participate in thermal management.
21This solution is platform independent and any type of thermal zone devices
22and cooling devices should be able to make use of the infrastructure.
23
24The main task of the thermal sysfs driver is to expose thermal zone attributes
25as well as cooling device attributes to the user space.
26An intelligent thermal management application can make decisions based on
27inputs from thermal zone attributes (the current temperature and trip point
28temperature) and throttle appropriate devices.
29
30- `[0-*]` denotes any positive number starting from 0
31- `[1-*]` denotes any positive number starting from 1
32
331. thermal sysfs driver interface functions
34===========================================
35
361.1 thermal zone device interface
37---------------------------------
38
39 ::
40
41 struct thermal_zone_device
42 *thermal_zone_device_register(char *type,
43 int trips, int mask, void *devdata,
44 struct thermal_zone_device_ops *ops,
45 const struct thermal_zone_params *tzp,
46 int passive_delay, int polling_delay))
47
48 This interface function adds a new thermal zone device (sensor) to
49 /sys/class/thermal folder as `thermal_zone[0-*]`. It tries to bind all the
50 thermal cooling devices registered at the same time.
51
52 type:
53 the thermal zone type.
54 trips:
55 the total number of trip points this thermal zone supports.
56 mask:
57 Bit string: If 'n'th bit is set, then trip point 'n' is writable.
58 devdata:
59 device private data
60 ops:
61 thermal zone device call-backs.
62
63 .bind:
64 bind the thermal zone device with a thermal cooling device.
65 .unbind:
66 unbind the thermal zone device with a thermal cooling device.
67 .get_temp:
68 get the current temperature of the thermal zone.
69 .set_trips:
70 set the trip points window. Whenever the current temperature
71 is updated, the trip points immediately below and above the
72 current temperature are found.
73 .get_mode:
74 get the current mode (enabled/disabled) of the thermal zone.
75
76 - "enabled" means the kernel thermal management is
77 enabled.
78 - "disabled" will prevent kernel thermal driver action
79 upon trip points so that user applications can take
80 charge of thermal management.
81 .set_mode:
82 set the mode (enabled/disabled) of the thermal zone.
83 .get_trip_type:
84 get the type of certain trip point.
85 .get_trip_temp:
86 get the temperature above which the certain trip point
87 will be fired.
88 .set_emul_temp:
89 set the emulation temperature which helps in debugging
90 different threshold temperature points.
91 tzp:
92 thermal zone platform parameters.
93 passive_delay:
94 number of milliseconds to wait between polls when
95 performing passive cooling.
96 polling_delay:
97 number of milliseconds to wait between polls when checking
98 whether trip points have been crossed (0 for interrupt driven systems).
99
100 ::
101
102 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
103
104 This interface function removes the thermal zone device.
105 It deletes the corresponding entry from /sys/class/thermal folder and
106 unbinds all the thermal cooling devices it uses.
107
108 ::
109
110 struct thermal_zone_device
111 *thermal_zone_of_sensor_register(struct device *dev, int sensor_id,
112 void *data,
113 const struct thermal_zone_of_device_ops *ops)
114
115 This interface adds a new sensor to a DT thermal zone.
116 This function will search the list of thermal zones described in
117 device tree and look for the zone that refer to the sensor device
118 pointed by dev->of_node as temperature providers. For the zone
119 pointing to the sensor node, the sensor will be added to the DT
120 thermal zone device.
121
122 The parameters for this interface are:
123
124 dev:
125 Device node of sensor containing valid node pointer in
126 dev->of_node.
127 sensor_id:
128 a sensor identifier, in case the sensor IP has more
129 than one sensors
130 data:
131 a private pointer (owned by the caller) that will be
132 passed back, when a temperature reading is needed.
133 ops:
134 `struct thermal_zone_of_device_ops *`.
135
136 ============== =======================================
137 get_temp a pointer to a function that reads the
138 sensor temperature. This is mandatory
139 callback provided by sensor driver.
140 set_trips a pointer to a function that sets a
141 temperature window. When this window is
142 left the driver must inform the thermal
143 core via thermal_zone_device_update.
144 get_trend a pointer to a function that reads the
145 sensor temperature trend.
146 set_emul_temp a pointer to a function that sets
147 sensor emulated temperature.
148 ============== =======================================
149
150 The thermal zone temperature is provided by the get_temp() function
151 pointer of thermal_zone_of_device_ops. When called, it will
152 have the private pointer @data back.
153
154 It returns error pointer if fails otherwise valid thermal zone device
155 handle. Caller should check the return handle with IS_ERR() for finding
156 whether success or not.
157
158 ::
159
160 void thermal_zone_of_sensor_unregister(struct device *dev,
161 struct thermal_zone_device *tzd)
162
163 This interface unregisters a sensor from a DT thermal zone which was
164 successfully added by interface thermal_zone_of_sensor_register().
165 This function removes the sensor callbacks and private data from the
166 thermal zone device registered with thermal_zone_of_sensor_register()
167 interface. It will also silent the zone by remove the .get_temp() and
168 get_trend() thermal zone device callbacks.
169
170 ::
171
172 struct thermal_zone_device
173 *devm_thermal_zone_of_sensor_register(struct device *dev,
174 int sensor_id,
175 void *data,
176 const struct thermal_zone_of_device_ops *ops)
177
178 This interface is resource managed version of
179 thermal_zone_of_sensor_register().
180
181 All details of thermal_zone_of_sensor_register() described in
182 section 1.1.3 is applicable here.
183
184 The benefit of using this interface to register sensor is that it
185 is not require to explicitly call thermal_zone_of_sensor_unregister()
186 in error path or during driver unbinding as this is done by driver
187 resource manager.
188
189 ::
190
191 void devm_thermal_zone_of_sensor_unregister(struct device *dev,
192 struct thermal_zone_device *tzd)
193
194 This interface is resource managed version of
195 thermal_zone_of_sensor_unregister().
196 All details of thermal_zone_of_sensor_unregister() described in
197 section 1.1.4 is applicable here.
198 Normally this function will not need to be called and the resource
199 management code will ensure that the resource is freed.
200
201 ::
202
203 int thermal_zone_get_slope(struct thermal_zone_device *tz)
204
205 This interface is used to read the slope attribute value
206 for the thermal zone device, which might be useful for platform
207 drivers for temperature calculations.
208
209 ::
210
211 int thermal_zone_get_offset(struct thermal_zone_device *tz)
212
213 This interface is used to read the offset attribute value
214 for the thermal zone device, which might be useful for platform
215 drivers for temperature calculations.
216
2171.2 thermal cooling device interface
218------------------------------------
219
220
221 ::
222
223 struct thermal_cooling_device
224 *thermal_cooling_device_register(char *name,
225 void *devdata, struct thermal_cooling_device_ops *)
226
227 This interface function adds a new thermal cooling device (fan/processor/...)
228 to /sys/class/thermal/ folder as `cooling_device[0-*]`. It tries to bind itself
229 to all the thermal zone devices registered at the same time.
230
231 name:
232 the cooling device name.
233 devdata:
234 device private data.
235 ops:
236 thermal cooling devices call-backs.
237
238 .get_max_state:
239 get the Maximum throttle state of the cooling device.
240 .get_cur_state:
241 get the Currently requested throttle state of the
242 cooling device.
243 .set_cur_state:
244 set the Current throttle state of the cooling device.
245
246 ::
247
248 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
249
250 This interface function removes the thermal cooling device.
251 It deletes the corresponding entry from /sys/class/thermal folder and
252 unbinds itself from all the thermal zone devices using it.
253
2541.3 interface for binding a thermal zone device with a thermal cooling device
255-----------------------------------------------------------------------------
256
257 ::
258
259 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
260 int trip, struct thermal_cooling_device *cdev,
261 unsigned long upper, unsigned long lower, unsigned int weight);
262
263 This interface function binds a thermal cooling device to a particular trip
264 point of a thermal zone device.
265
266 This function is usually called in the thermal zone device .bind callback.
267
268 tz:
269 the thermal zone device
270 cdev:
271 thermal cooling device
272 trip:
273 indicates which trip point in this thermal zone the cooling device
274 is associated with.
275 upper:
276 the Maximum cooling state for this trip point.
277 THERMAL_NO_LIMIT means no upper limit,
278 and the cooling device can be in max_state.
279 lower:
280 the Minimum cooling state can be used for this trip point.
281 THERMAL_NO_LIMIT means no lower limit,
282 and the cooling device can be in cooling state 0.
283 weight:
284 the influence of this cooling device in this thermal
285 zone. See 1.4.1 below for more information.
286
287 ::
288
289 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
290 int trip, struct thermal_cooling_device *cdev);
291
292 This interface function unbinds a thermal cooling device from a particular
293 trip point of a thermal zone device. This function is usually called in
294 the thermal zone device .unbind callback.
295
296 tz:
297 the thermal zone device
298 cdev:
299 thermal cooling device
300 trip:
301 indicates which trip point in this thermal zone the cooling device
302 is associated with.
303
3041.4 Thermal Zone Parameters
305---------------------------
306
307 ::
308
309 struct thermal_zone_params
310
311 This structure defines the platform level parameters for a thermal zone.
312 This data, for each thermal zone should come from the platform layer.
313 This is an optional feature where some platforms can choose not to
314 provide this data.
315
316 .governor_name:
317 Name of the thermal governor used for this zone
318 .no_hwmon:
319 a boolean to indicate if the thermal to hwmon sysfs interface
320 is required. when no_hwmon == false, a hwmon sysfs interface
321 will be created. when no_hwmon == true, nothing will be done.
322 In case the thermal_zone_params is NULL, the hwmon interface
323 will be created (for backward compatibility).
324
3252. sysfs attributes structure
326=============================
327
328== ================
329RO read only value
330WO write only value
331RW read/write value
332== ================
333
334Thermal sysfs attributes will be represented under /sys/class/thermal.
335Hwmon sysfs I/F extension is also available under /sys/class/hwmon
336if hwmon is compiled in or built as a module.
337
338Thermal zone device sys I/F, created once it's registered::
339
340 /sys/class/thermal/thermal_zone[0-*]:
341 |---type: Type of the thermal zone
342 |---temp: Current temperature
343 |---mode: Working mode of the thermal zone
344 |---policy: Thermal governor used for this zone
345 |---available_policies: Available thermal governors for this zone
346 |---trip_point_[0-*]_temp: Trip point temperature
347 |---trip_point_[0-*]_type: Trip point type
348 |---trip_point_[0-*]_hyst: Hysteresis value for this trip point
349 |---emul_temp: Emulated temperature set node
350 |---sustainable_power: Sustainable dissipatable power
351 |---k_po: Proportional term during temperature overshoot
352 |---k_pu: Proportional term during temperature undershoot
353 |---k_i: PID's integral term in the power allocator gov
354 |---k_d: PID's derivative term in the power allocator
355 |---integral_cutoff: Offset above which errors are accumulated
356 |---slope: Slope constant applied as linear extrapolation
357 |---offset: Offset constant applied as linear extrapolation
358
359Thermal cooling device sys I/F, created once it's registered::
360
361 /sys/class/thermal/cooling_device[0-*]:
362 |---type: Type of the cooling device(processor/fan/...)
363 |---max_state: Maximum cooling state of the cooling device
364 |---cur_state: Current cooling state of the cooling device
365 |---stats: Directory containing cooling device's statistics
366 |---stats/reset: Writing any value resets the statistics
367 |---stats/time_in_state_ms: Time (msec) spent in various cooling states
368 |---stats/total_trans: Total number of times cooling state is changed
369 |---stats/trans_table: Cooling state transition table
370
371
372Then next two dynamic attributes are created/removed in pairs. They represent
373the relationship between a thermal zone and its associated cooling device.
374They are created/removed for each successful execution of
375thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
376
377::
378
379 /sys/class/thermal/thermal_zone[0-*]:
380 |---cdev[0-*]: [0-*]th cooling device in current thermal zone
381 |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
382 |---cdev[0-*]_weight: Influence of the cooling device in
383 this thermal zone
384
385Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
386the generic thermal driver also creates a hwmon sysfs I/F for each _type_
387of thermal zone device. E.g. the generic thermal driver registers one hwmon
388class device and build the associated hwmon sysfs I/F for all the registered
389ACPI thermal zones.
390
391Please read Documentation/ABI/testing/sysfs-class-thermal for thermal
392zone and cooling device attribute details.
393
394::
395
396 /sys/class/hwmon/hwmon[0-*]:
397 |---name: The type of the thermal zone devices
398 |---temp[1-*]_input: The current temperature of thermal zone [1-*]
399 |---temp[1-*]_critical: The critical trip point of thermal zone [1-*]
400
401Please read Documentation/hwmon/sysfs-interface.rst for additional information.
402
4033. A simple implementation
404==========================
405
406ACPI thermal zone may support multiple trip points like critical, hot,
407passive, active. If an ACPI thermal zone supports critical, passive,
408active[0] and active[1] at the same time, it may register itself as a
409thermal_zone_device (thermal_zone1) with 4 trip points in all.
410It has one processor and one fan, which are both registered as
411thermal_cooling_device. Both are considered to have the same
412effectiveness in cooling the thermal zone.
413
414If the processor is listed in _PSL method, and the fan is listed in _AL0
415method, the sys I/F structure will be built like this::
416
417 /sys/class/thermal:
418 |thermal_zone1:
419 |---type: acpitz
420 |---temp: 37000
421 |---mode: enabled
422 |---policy: step_wise
423 |---available_policies: step_wise fair_share
424 |---trip_point_0_temp: 100000
425 |---trip_point_0_type: critical
426 |---trip_point_1_temp: 80000
427 |---trip_point_1_type: passive
428 |---trip_point_2_temp: 70000
429 |---trip_point_2_type: active0
430 |---trip_point_3_temp: 60000
431 |---trip_point_3_type: active1
432 |---cdev0: --->/sys/class/thermal/cooling_device0
433 |---cdev0_trip_point: 1 /* cdev0 can be used for passive */
434 |---cdev0_weight: 1024
435 |---cdev1: --->/sys/class/thermal/cooling_device3
436 |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
437 |---cdev1_weight: 1024
438
439 |cooling_device0:
440 |---type: Processor
441 |---max_state: 8
442 |---cur_state: 0
443
444 |cooling_device3:
445 |---type: Fan
446 |---max_state: 2
447 |---cur_state: 0
448
449 /sys/class/hwmon:
450 |hwmon0:
451 |---name: acpitz
452 |---temp1_input: 37000
453 |---temp1_crit: 100000
454
4554. Export Symbol APIs
456=====================
457
4584.1. get_tz_trend
459-----------------
460
461This function returns the trend of a thermal zone, i.e the rate of change
462of temperature of the thermal zone. Ideally, the thermal sensor drivers
463are supposed to implement the callback. If they don't, the thermal
464framework calculated the trend by comparing the previous and the current
465temperature values.
466
4674.2. get_thermal_instance
468-------------------------
469
470This function returns the thermal_instance corresponding to a given
471{thermal_zone, cooling_device, trip_point} combination. Returns NULL
472if such an instance does not exist.
473
4744.3. thermal_cdev_update
475------------------------
476
477This function serves as an arbitrator to set the state of a cooling
478device. It sets the cooling device to the deepest cooling state if
479possible.
480
4815. thermal_emergency_poweroff
482=============================
483
484On an event of critical trip temperature crossing the thermal framework
485shuts down the system by calling hw_protection_shutdown(). The
486hw_protection_shutdown() first attempts to perform an orderly shutdown
487but accepts a delay after which it proceeds doing a forced power-off
488or as last resort an emergency_restart.
489
490The delay should be carefully profiled so as to give adequate time for
491orderly poweroff.
492
493If the delay is set to 0 emergency poweroff will not be supported. So a
494carefully profiled non-zero positive value is a must for emergency
495poweroff to be triggered.
1===================================
2Generic Thermal Sysfs driver How To
3===================================
4
5Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
6
7Updated: 2 January 2008
8
9Copyright (c) 2008 Intel Corporation
10
11
120. Introduction
13===============
14
15The generic thermal sysfs provides a set of interfaces for thermal zone
16devices (sensors) and thermal cooling devices (fan, processor...) to register
17with the thermal management solution and to be a part of it.
18
19This how-to focuses on enabling new thermal zone and cooling devices to
20participate in thermal management.
21This solution is platform independent and any type of thermal zone devices
22and cooling devices should be able to make use of the infrastructure.
23
24The main task of the thermal sysfs driver is to expose thermal zone attributes
25as well as cooling device attributes to the user space.
26An intelligent thermal management application can make decisions based on
27inputs from thermal zone attributes (the current temperature and trip point
28temperature) and throttle appropriate devices.
29
30- `[0-*]` denotes any positive number starting from 0
31- `[1-*]` denotes any positive number starting from 1
32
331. thermal sysfs driver interface functions
34===========================================
35
361.1 thermal zone device interface
37---------------------------------
38
39 ::
40
41 struct thermal_zone_device
42 *thermal_zone_device_register(char *type,
43 int trips, int mask, void *devdata,
44 struct thermal_zone_device_ops *ops,
45 const struct thermal_zone_params *tzp,
46 int passive_delay, int polling_delay))
47
48 This interface function adds a new thermal zone device (sensor) to
49 /sys/class/thermal folder as `thermal_zone[0-*]`. It tries to bind all the
50 thermal cooling devices registered at the same time.
51
52 type:
53 the thermal zone type.
54 trips:
55 the total number of trip points this thermal zone supports.
56 mask:
57 Bit string: If 'n'th bit is set, then trip point 'n' is writeable.
58 devdata:
59 device private data
60 ops:
61 thermal zone device call-backs.
62
63 .bind:
64 bind the thermal zone device with a thermal cooling device.
65 .unbind:
66 unbind the thermal zone device with a thermal cooling device.
67 .get_temp:
68 get the current temperature of the thermal zone.
69 .set_trips:
70 set the trip points window. Whenever the current temperature
71 is updated, the trip points immediately below and above the
72 current temperature are found.
73 .get_mode:
74 get the current mode (enabled/disabled) of the thermal zone.
75
76 - "enabled" means the kernel thermal management is
77 enabled.
78 - "disabled" will prevent kernel thermal driver action
79 upon trip points so that user applications can take
80 charge of thermal management.
81 .set_mode:
82 set the mode (enabled/disabled) of the thermal zone.
83 .get_trip_type:
84 get the type of certain trip point.
85 .get_trip_temp:
86 get the temperature above which the certain trip point
87 will be fired.
88 .set_emul_temp:
89 set the emulation temperature which helps in debugging
90 different threshold temperature points.
91 tzp:
92 thermal zone platform parameters.
93 passive_delay:
94 number of milliseconds to wait between polls when
95 performing passive cooling.
96 polling_delay:
97 number of milliseconds to wait between polls when checking
98 whether trip points have been crossed (0 for interrupt driven systems).
99
100 ::
101
102 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
103
104 This interface function removes the thermal zone device.
105 It deletes the corresponding entry from /sys/class/thermal folder and
106 unbinds all the thermal cooling devices it uses.
107
108 ::
109
110 struct thermal_zone_device
111 *thermal_zone_of_sensor_register(struct device *dev, int sensor_id,
112 void *data,
113 const struct thermal_zone_of_device_ops *ops)
114
115 This interface adds a new sensor to a DT thermal zone.
116 This function will search the list of thermal zones described in
117 device tree and look for the zone that refer to the sensor device
118 pointed by dev->of_node as temperature providers. For the zone
119 pointing to the sensor node, the sensor will be added to the DT
120 thermal zone device.
121
122 The parameters for this interface are:
123
124 dev:
125 Device node of sensor containing valid node pointer in
126 dev->of_node.
127 sensor_id:
128 a sensor identifier, in case the sensor IP has more
129 than one sensors
130 data:
131 a private pointer (owned by the caller) that will be
132 passed back, when a temperature reading is needed.
133 ops:
134 `struct thermal_zone_of_device_ops *`.
135
136 ============== =======================================
137 get_temp a pointer to a function that reads the
138 sensor temperature. This is mandatory
139 callback provided by sensor driver.
140 set_trips a pointer to a function that sets a
141 temperature window. When this window is
142 left the driver must inform the thermal
143 core via thermal_zone_device_update.
144 get_trend a pointer to a function that reads the
145 sensor temperature trend.
146 set_emul_temp a pointer to a function that sets
147 sensor emulated temperature.
148 ============== =======================================
149
150 The thermal zone temperature is provided by the get_temp() function
151 pointer of thermal_zone_of_device_ops. When called, it will
152 have the private pointer @data back.
153
154 It returns error pointer if fails otherwise valid thermal zone device
155 handle. Caller should check the return handle with IS_ERR() for finding
156 whether success or not.
157
158 ::
159
160 void thermal_zone_of_sensor_unregister(struct device *dev,
161 struct thermal_zone_device *tzd)
162
163 This interface unregisters a sensor from a DT thermal zone which was
164 successfully added by interface thermal_zone_of_sensor_register().
165 This function removes the sensor callbacks and private data from the
166 thermal zone device registered with thermal_zone_of_sensor_register()
167 interface. It will also silent the zone by remove the .get_temp() and
168 get_trend() thermal zone device callbacks.
169
170 ::
171
172 struct thermal_zone_device
173 *devm_thermal_zone_of_sensor_register(struct device *dev,
174 int sensor_id,
175 void *data,
176 const struct thermal_zone_of_device_ops *ops)
177
178 This interface is resource managed version of
179 thermal_zone_of_sensor_register().
180
181 All details of thermal_zone_of_sensor_register() described in
182 section 1.1.3 is applicable here.
183
184 The benefit of using this interface to register sensor is that it
185 is not require to explicitly call thermal_zone_of_sensor_unregister()
186 in error path or during driver unbinding as this is done by driver
187 resource manager.
188
189 ::
190
191 void devm_thermal_zone_of_sensor_unregister(struct device *dev,
192 struct thermal_zone_device *tzd)
193
194 This interface is resource managed version of
195 thermal_zone_of_sensor_unregister().
196 All details of thermal_zone_of_sensor_unregister() described in
197 section 1.1.4 is applicable here.
198 Normally this function will not need to be called and the resource
199 management code will ensure that the resource is freed.
200
201 ::
202
203 int thermal_zone_get_slope(struct thermal_zone_device *tz)
204
205 This interface is used to read the slope attribute value
206 for the thermal zone device, which might be useful for platform
207 drivers for temperature calculations.
208
209 ::
210
211 int thermal_zone_get_offset(struct thermal_zone_device *tz)
212
213 This interface is used to read the offset attribute value
214 for the thermal zone device, which might be useful for platform
215 drivers for temperature calculations.
216
2171.2 thermal cooling device interface
218------------------------------------
219
220
221 ::
222
223 struct thermal_cooling_device
224 *thermal_cooling_device_register(char *name,
225 void *devdata, struct thermal_cooling_device_ops *)
226
227 This interface function adds a new thermal cooling device (fan/processor/...)
228 to /sys/class/thermal/ folder as `cooling_device[0-*]`. It tries to bind itself
229 to all the thermal zone devices registered at the same time.
230
231 name:
232 the cooling device name.
233 devdata:
234 device private data.
235 ops:
236 thermal cooling devices call-backs.
237
238 .get_max_state:
239 get the Maximum throttle state of the cooling device.
240 .get_cur_state:
241 get the Currently requested throttle state of the
242 cooling device.
243 .set_cur_state:
244 set the Current throttle state of the cooling device.
245
246 ::
247
248 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
249
250 This interface function removes the thermal cooling device.
251 It deletes the corresponding entry from /sys/class/thermal folder and
252 unbinds itself from all the thermal zone devices using it.
253
2541.3 interface for binding a thermal zone device with a thermal cooling device
255-----------------------------------------------------------------------------
256
257 ::
258
259 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
260 int trip, struct thermal_cooling_device *cdev,
261 unsigned long upper, unsigned long lower, unsigned int weight);
262
263 This interface function binds a thermal cooling device to a particular trip
264 point of a thermal zone device.
265
266 This function is usually called in the thermal zone device .bind callback.
267
268 tz:
269 the thermal zone device
270 cdev:
271 thermal cooling device
272 trip:
273 indicates which trip point in this thermal zone the cooling device
274 is associated with.
275 upper:
276 the Maximum cooling state for this trip point.
277 THERMAL_NO_LIMIT means no upper limit,
278 and the cooling device can be in max_state.
279 lower:
280 the Minimum cooling state can be used for this trip point.
281 THERMAL_NO_LIMIT means no lower limit,
282 and the cooling device can be in cooling state 0.
283 weight:
284 the influence of this cooling device in this thermal
285 zone. See 1.4.1 below for more information.
286
287 ::
288
289 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
290 int trip, struct thermal_cooling_device *cdev);
291
292 This interface function unbinds a thermal cooling device from a particular
293 trip point of a thermal zone device. This function is usually called in
294 the thermal zone device .unbind callback.
295
296 tz:
297 the thermal zone device
298 cdev:
299 thermal cooling device
300 trip:
301 indicates which trip point in this thermal zone the cooling device
302 is associated with.
303
3041.4 Thermal Zone Parameters
305---------------------------
306
307 ::
308
309 struct thermal_bind_params
310
311 This structure defines the following parameters that are used to bind
312 a zone with a cooling device for a particular trip point.
313
314 .cdev:
315 The cooling device pointer
316 .weight:
317 The 'influence' of a particular cooling device on this
318 zone. This is relative to the rest of the cooling
319 devices. For example, if all cooling devices have a
320 weight of 1, then they all contribute the same. You can
321 use percentages if you want, but it's not mandatory. A
322 weight of 0 means that this cooling device doesn't
323 contribute to the cooling of this zone unless all cooling
324 devices have a weight of 0. If all weights are 0, then
325 they all contribute the same.
326 .trip_mask:
327 This is a bit mask that gives the binding relation between
328 this thermal zone and cdev, for a particular trip point.
329 If nth bit is set, then the cdev and thermal zone are bound
330 for trip point n.
331 .binding_limits:
332 This is an array of cooling state limits. Must have
333 exactly 2 * thermal_zone.number_of_trip_points. It is an
334 array consisting of tuples <lower-state upper-state> of
335 state limits. Each trip will be associated with one state
336 limit tuple when binding. A NULL pointer means
337 <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips.
338 These limits are used when binding a cdev to a trip point.
339 .match:
340 This call back returns success(0) if the 'tz and cdev' need to
341 be bound, as per platform data.
342
343 ::
344
345 struct thermal_zone_params
346
347 This structure defines the platform level parameters for a thermal zone.
348 This data, for each thermal zone should come from the platform layer.
349 This is an optional feature where some platforms can choose not to
350 provide this data.
351
352 .governor_name:
353 Name of the thermal governor used for this zone
354 .no_hwmon:
355 a boolean to indicate if the thermal to hwmon sysfs interface
356 is required. when no_hwmon == false, a hwmon sysfs interface
357 will be created. when no_hwmon == true, nothing will be done.
358 In case the thermal_zone_params is NULL, the hwmon interface
359 will be created (for backward compatibility).
360 .num_tbps:
361 Number of thermal_bind_params entries for this zone
362 .tbp:
363 thermal_bind_params entries
364
3652. sysfs attributes structure
366=============================
367
368== ================
369RO read only value
370WO write only value
371RW read/write value
372== ================
373
374Thermal sysfs attributes will be represented under /sys/class/thermal.
375Hwmon sysfs I/F extension is also available under /sys/class/hwmon
376if hwmon is compiled in or built as a module.
377
378Thermal zone device sys I/F, created once it's registered::
379
380 /sys/class/thermal/thermal_zone[0-*]:
381 |---type: Type of the thermal zone
382 |---temp: Current temperature
383 |---mode: Working mode of the thermal zone
384 |---policy: Thermal governor used for this zone
385 |---available_policies: Available thermal governors for this zone
386 |---trip_point_[0-*]_temp: Trip point temperature
387 |---trip_point_[0-*]_type: Trip point type
388 |---trip_point_[0-*]_hyst: Hysteresis value for this trip point
389 |---emul_temp: Emulated temperature set node
390 |---sustainable_power: Sustainable dissipatable power
391 |---k_po: Proportional term during temperature overshoot
392 |---k_pu: Proportional term during temperature undershoot
393 |---k_i: PID's integral term in the power allocator gov
394 |---k_d: PID's derivative term in the power allocator
395 |---integral_cutoff: Offset above which errors are accumulated
396 |---slope: Slope constant applied as linear extrapolation
397 |---offset: Offset constant applied as linear extrapolation
398
399Thermal cooling device sys I/F, created once it's registered::
400
401 /sys/class/thermal/cooling_device[0-*]:
402 |---type: Type of the cooling device(processor/fan/...)
403 |---max_state: Maximum cooling state of the cooling device
404 |---cur_state: Current cooling state of the cooling device
405 |---stats: Directory containing cooling device's statistics
406 |---stats/reset: Writing any value resets the statistics
407 |---stats/time_in_state_ms: Time (msec) spent in various cooling states
408 |---stats/total_trans: Total number of times cooling state is changed
409 |---stats/trans_table: Cooing state transition table
410
411
412Then next two dynamic attributes are created/removed in pairs. They represent
413the relationship between a thermal zone and its associated cooling device.
414They are created/removed for each successful execution of
415thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
416
417::
418
419 /sys/class/thermal/thermal_zone[0-*]:
420 |---cdev[0-*]: [0-*]th cooling device in current thermal zone
421 |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
422 |---cdev[0-*]_weight: Influence of the cooling device in
423 this thermal zone
424
425Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
426the generic thermal driver also creates a hwmon sysfs I/F for each _type_
427of thermal zone device. E.g. the generic thermal driver registers one hwmon
428class device and build the associated hwmon sysfs I/F for all the registered
429ACPI thermal zones.
430
431::
432
433 /sys/class/hwmon/hwmon[0-*]:
434 |---name: The type of the thermal zone devices
435 |---temp[1-*]_input: The current temperature of thermal zone [1-*]
436 |---temp[1-*]_critical: The critical trip point of thermal zone [1-*]
437
438Please read Documentation/hwmon/sysfs-interface.rst for additional information.
439
440Thermal zone attributes
441-----------------------
442
443type
444 Strings which represent the thermal zone type.
445 This is given by thermal zone driver as part of registration.
446 E.g: "acpitz" indicates it's an ACPI thermal device.
447 In order to keep it consistent with hwmon sys attribute; this should
448 be a short, lowercase string, not containing spaces nor dashes.
449 RO, Required
450
451temp
452 Current temperature as reported by thermal zone (sensor).
453 Unit: millidegree Celsius
454 RO, Required
455
456mode
457 One of the predefined values in [enabled, disabled].
458 This file gives information about the algorithm that is currently
459 managing the thermal zone. It can be either default kernel based
460 algorithm or user space application.
461
462 enabled
463 enable Kernel Thermal management.
464 disabled
465 Preventing kernel thermal zone driver actions upon
466 trip points so that user application can take full
467 charge of the thermal management.
468
469 RW, Optional
470
471policy
472 One of the various thermal governors used for a particular zone.
473
474 RW, Required
475
476available_policies
477 Available thermal governors which can be used for a particular zone.
478
479 RO, Required
480
481`trip_point_[0-*]_temp`
482 The temperature above which trip point will be fired.
483
484 Unit: millidegree Celsius
485
486 RO, Optional
487
488`trip_point_[0-*]_type`
489 Strings which indicate the type of the trip point.
490
491 E.g. it can be one of critical, hot, passive, `active[0-*]` for ACPI
492 thermal zone.
493
494 RO, Optional
495
496`trip_point_[0-*]_hyst`
497 The hysteresis value for a trip point, represented as an integer
498 Unit: Celsius
499 RW, Optional
500
501`cdev[0-*]`
502 Sysfs link to the thermal cooling device node where the sys I/F
503 for cooling device throttling control represents.
504
505 RO, Optional
506
507`cdev[0-*]_trip_point`
508 The trip point in this thermal zone which `cdev[0-*]` is associated
509 with; -1 means the cooling device is not associated with any trip
510 point.
511
512 RO, Optional
513
514`cdev[0-*]_weight`
515 The influence of `cdev[0-*]` in this thermal zone. This value
516 is relative to the rest of cooling devices in the thermal
517 zone. For example, if a cooling device has a weight double
518 than that of other, it's twice as effective in cooling the
519 thermal zone.
520
521 RW, Optional
522
523passive
524 Attribute is only present for zones in which the passive cooling
525 policy is not supported by native thermal driver. Default is zero
526 and can be set to a temperature (in millidegrees) to enable a
527 passive trip point for the zone. Activation is done by polling with
528 an interval of 1 second.
529
530 Unit: millidegrees Celsius
531
532 Valid values: 0 (disabled) or greater than 1000
533
534 RW, Optional
535
536emul_temp
537 Interface to set the emulated temperature method in thermal zone
538 (sensor). After setting this temperature, the thermal zone may pass
539 this temperature to platform emulation function if registered or
540 cache it locally. This is useful in debugging different temperature
541 threshold and its associated cooling action. This is write only node
542 and writing 0 on this node should disable emulation.
543 Unit: millidegree Celsius
544
545 WO, Optional
546
547 WARNING:
548 Be careful while enabling this option on production systems,
549 because userland can easily disable the thermal policy by simply
550 flooding this sysfs node with low temperature values.
551
552sustainable_power
553 An estimate of the sustained power that can be dissipated by
554 the thermal zone. Used by the power allocator governor. For
555 more information see Documentation/driver-api/thermal/power_allocator.rst
556
557 Unit: milliwatts
558
559 RW, Optional
560
561k_po
562 The proportional term of the power allocator governor's PID
563 controller during temperature overshoot. Temperature overshoot
564 is when the current temperature is above the "desired
565 temperature" trip point. For more information see
566 Documentation/driver-api/thermal/power_allocator.rst
567
568 RW, Optional
569
570k_pu
571 The proportional term of the power allocator governor's PID
572 controller during temperature undershoot. Temperature undershoot
573 is when the current temperature is below the "desired
574 temperature" trip point. For more information see
575 Documentation/driver-api/thermal/power_allocator.rst
576
577 RW, Optional
578
579k_i
580 The integral term of the power allocator governor's PID
581 controller. This term allows the PID controller to compensate
582 for long term drift. For more information see
583 Documentation/driver-api/thermal/power_allocator.rst
584
585 RW, Optional
586
587k_d
588 The derivative term of the power allocator governor's PID
589 controller. For more information see
590 Documentation/driver-api/thermal/power_allocator.rst
591
592 RW, Optional
593
594integral_cutoff
595 Temperature offset from the desired temperature trip point
596 above which the integral term of the power allocator
597 governor's PID controller starts accumulating errors. For
598 example, if integral_cutoff is 0, then the integral term only
599 accumulates error when temperature is above the desired
600 temperature trip point. For more information see
601 Documentation/driver-api/thermal/power_allocator.rst
602
603 Unit: millidegree Celsius
604
605 RW, Optional
606
607slope
608 The slope constant used in a linear extrapolation model
609 to determine a hotspot temperature based off the sensor's
610 raw readings. It is up to the device driver to determine
611 the usage of these values.
612
613 RW, Optional
614
615offset
616 The offset constant used in a linear extrapolation model
617 to determine a hotspot temperature based off the sensor's
618 raw readings. It is up to the device driver to determine
619 the usage of these values.
620
621 RW, Optional
622
623Cooling device attributes
624-------------------------
625
626type
627 String which represents the type of device, e.g:
628
629 - for generic ACPI: should be "Fan", "Processor" or "LCD"
630 - for memory controller device on intel_menlow platform:
631 should be "Memory controller".
632
633 RO, Required
634
635max_state
636 The maximum permissible cooling state of this cooling device.
637
638 RO, Required
639
640cur_state
641 The current cooling state of this cooling device.
642 The value can any integer numbers between 0 and max_state:
643
644 - cur_state == 0 means no cooling
645 - cur_state == max_state means the maximum cooling.
646
647 RW, Required
648
649stats/reset
650 Writing any value resets the cooling device's statistics.
651 WO, Required
652
653stats/time_in_state_ms:
654 The amount of time spent by the cooling device in various cooling
655 states. The output will have "<state> <time>" pair in each line, which
656 will mean this cooling device spent <time> msec of time at <state>.
657 Output will have one line for each of the supported states. usertime
658 units here is 10mS (similar to other time exported in /proc).
659 RO, Required
660
661
662stats/total_trans:
663 A single positive value showing the total number of times the state of a
664 cooling device is changed.
665
666 RO, Required
667
668stats/trans_table:
669 This gives fine grained information about all the cooling state
670 transitions. The cat output here is a two dimensional matrix, where an
671 entry <i,j> (row i, column j) represents the number of transitions from
672 State_i to State_j. If the transition table is bigger than PAGE_SIZE,
673 reading this will return an -EFBIG error.
674 RO, Required
675
6763. A simple implementation
677==========================
678
679ACPI thermal zone may support multiple trip points like critical, hot,
680passive, active. If an ACPI thermal zone supports critical, passive,
681active[0] and active[1] at the same time, it may register itself as a
682thermal_zone_device (thermal_zone1) with 4 trip points in all.
683It has one processor and one fan, which are both registered as
684thermal_cooling_device. Both are considered to have the same
685effectiveness in cooling the thermal zone.
686
687If the processor is listed in _PSL method, and the fan is listed in _AL0
688method, the sys I/F structure will be built like this::
689
690 /sys/class/thermal:
691 |thermal_zone1:
692 |---type: acpitz
693 |---temp: 37000
694 |---mode: enabled
695 |---policy: step_wise
696 |---available_policies: step_wise fair_share
697 |---trip_point_0_temp: 100000
698 |---trip_point_0_type: critical
699 |---trip_point_1_temp: 80000
700 |---trip_point_1_type: passive
701 |---trip_point_2_temp: 70000
702 |---trip_point_2_type: active0
703 |---trip_point_3_temp: 60000
704 |---trip_point_3_type: active1
705 |---cdev0: --->/sys/class/thermal/cooling_device0
706 |---cdev0_trip_point: 1 /* cdev0 can be used for passive */
707 |---cdev0_weight: 1024
708 |---cdev1: --->/sys/class/thermal/cooling_device3
709 |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
710 |---cdev1_weight: 1024
711
712 |cooling_device0:
713 |---type: Processor
714 |---max_state: 8
715 |---cur_state: 0
716
717 |cooling_device3:
718 |---type: Fan
719 |---max_state: 2
720 |---cur_state: 0
721
722 /sys/class/hwmon:
723 |hwmon0:
724 |---name: acpitz
725 |---temp1_input: 37000
726 |---temp1_crit: 100000
727
7284. Event Notification
729=====================
730
731The framework includes a simple notification mechanism, in the form of a
732netlink event. Netlink socket initialization is done during the _init_
733of the framework. Drivers which intend to use the notification mechanism
734just need to call thermal_generate_netlink_event() with two arguments viz
735(originator, event). The originator is a pointer to struct thermal_zone_device
736from where the event has been originated. An integer which represents the
737thermal zone device will be used in the message to identify the zone. The
738event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL,
739THERMAL_DEV_FAULT}. Notification can be sent when the current temperature
740crosses any of the configured thresholds.
741
7425. Export Symbol APIs
743=====================
744
7455.1. get_tz_trend
746-----------------
747
748This function returns the trend of a thermal zone, i.e the rate of change
749of temperature of the thermal zone. Ideally, the thermal sensor drivers
750are supposed to implement the callback. If they don't, the thermal
751framework calculated the trend by comparing the previous and the current
752temperature values.
753
7545.2. get_thermal_instance
755-------------------------
756
757This function returns the thermal_instance corresponding to a given
758{thermal_zone, cooling_device, trip_point} combination. Returns NULL
759if such an instance does not exist.
760
7615.3. thermal_notify_framework
762-----------------------------
763
764This function handles the trip events from sensor drivers. It starts
765throttling the cooling devices according to the policy configured.
766For CRITICAL and HOT trip points, this notifies the respective drivers,
767and does actual throttling for other trip points i.e ACTIVE and PASSIVE.
768The throttling policy is based on the configured platform data; if no
769platform data is provided, this uses the step_wise throttling policy.
770
7715.4. thermal_cdev_update
772------------------------
773
774This function serves as an arbitrator to set the state of a cooling
775device. It sets the cooling device to the deepest cooling state if
776possible.
777
7786. thermal_emergency_poweroff
779=============================
780
781On an event of critical trip temperature crossing. Thermal framework
782allows the system to shutdown gracefully by calling orderly_poweroff().
783In the event of a failure of orderly_poweroff() to shut down the system
784we are in danger of keeping the system alive at undesirably high
785temperatures. To mitigate this high risk scenario we program a work
786queue to fire after a pre-determined number of seconds to start
787an emergency shutdown of the device using the kernel_power_off()
788function. In case kernel_power_off() fails then finally
789emergency_restart() is called in the worst case.
790
791The delay should be carefully profiled so as to give adequate time for
792orderly_poweroff(). In case of failure of an orderly_poweroff() the
793emergency poweroff kicks in after the delay has elapsed and shuts down
794the system.
795
796If set to 0 emergency poweroff will not be supported. So a carefully
797profiled non-zero positive value is a must for emergerncy poweroff to be
798triggered.