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1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7 bool "Thermal drivers"
8 help
9 Thermal drivers offer a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zones and cooling devices.
12 Each thermal zone contains its own temperature, trip points,
13 and cooling devices.
14 All platforms with ACPI or Open Firmware thermal support can use
15 this driver.
16 If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_NETLINK
21 bool "Thermal netlink management"
22 depends on NET
23 help
24 The thermal framework has a netlink interface to do thermal
25 zones discovery, temperature readings and events such as
26 trip point crossed, cooling device update or governor
27 change. It is recommended to enable the feature.
28
29config THERMAL_STATISTICS
30 bool "Thermal state transition statistics"
31 help
32 Export thermal state transition statistics information through sysfs.
33
34 If in doubt, say N.
35
36config THERMAL_DEBUGFS
37 bool "Thermal subsystem debug support"
38 depends on DEBUG_FS
39 help
40 Say Y to allow the thermal subsystem to collect diagnostic
41 information that can be accessed via debugfs.
42
43config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
44 int "Emergency poweroff delay in milli-seconds"
45 default 0
46 help
47 Thermal subsystem will issue a graceful shutdown when
48 critical temperatures are reached using orderly_poweroff(). In
49 case of failure of an orderly_poweroff(), the thermal emergency
50 poweroff kicks in after a delay has elapsed and shuts down the system.
51 This config is number of milliseconds to delay before emergency
52 poweroff kicks in. Similarly to the critical trip point,
53 the delay should be carefully profiled so as to give adequate
54 time for orderly_poweroff() to finish on regular execution.
55 If set to 0 emergency poweroff will not be supported.
56
57 In doubt, leave as 0.
58
59config THERMAL_HWMON
60 bool
61 prompt "Expose thermal sensors as hwmon device"
62 depends on HWMON=y || HWMON=THERMAL
63 default y
64 help
65 In case a sensor is registered with the thermal
66 framework, this option will also register it
67 as a hwmon. The sensor will then have the common
68 hwmon sysfs interface.
69
70 Say 'Y' here if you want all thermal sensors to
71 have hwmon sysfs interface too.
72
73config THERMAL_OF
74 bool
75 prompt "APIs to parse thermal data out of device tree"
76 depends on OF
77 default y
78 help
79 This options provides helpers to add the support to
80 read and parse thermal data definitions out of the
81 device tree blob.
82
83 Say 'Y' here if you need to build thermal infrastructure
84 based on device tree.
85
86config THERMAL_WRITABLE_TRIPS
87 bool "Enable writable trip points"
88 help
89 This option allows the system integrator to choose whether
90 trip temperatures can be changed from userspace. The
91 writable trips need to be specified when setting up the
92 thermal zone but the choice here takes precedence.
93
94 Say 'Y' here if you would like to allow userspace tools to
95 change trip temperatures.
96
97choice
98 prompt "Default Thermal governor"
99 default THERMAL_DEFAULT_GOV_STEP_WISE
100 help
101 This option sets which thermal governor shall be loaded at
102 startup. If in doubt, select 'step_wise'.
103
104config THERMAL_DEFAULT_GOV_STEP_WISE
105 bool "step_wise"
106 select THERMAL_GOV_STEP_WISE
107 help
108 Use the step_wise governor as default. This throttles the
109 devices one step at a time.
110
111config THERMAL_DEFAULT_GOV_FAIR_SHARE
112 bool "fair_share"
113 select THERMAL_GOV_FAIR_SHARE
114 help
115 Use the fair_share governor as default. This throttles the
116 devices based on their 'contribution' to a zone. The
117 contribution should be provided through platform data.
118
119config THERMAL_DEFAULT_GOV_USER_SPACE
120 bool "user_space"
121 select THERMAL_GOV_USER_SPACE
122 help
123 The Userspace governor allows to get trip point crossed
124 notification from the kernel via uevents. It is recommended
125 to use the netlink interface instead which gives richer
126 information about the thermal framework events.
127
128config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
129 bool "power_allocator"
130 depends on THERMAL_GOV_POWER_ALLOCATOR
131 help
132 Select this if you want to control temperature based on
133 system and device power allocation. This governor can only
134 operate on cooling devices that implement the power API.
135
136config THERMAL_DEFAULT_GOV_BANG_BANG
137 bool "bang_bang"
138 depends on THERMAL_GOV_BANG_BANG
139 help
140 Use the bang_bang governor as default. This throttles the
141 devices one step at the time, taking into account the trip
142 point hysteresis.
143
144endchoice
145
146config THERMAL_GOV_FAIR_SHARE
147 bool "Fair-share thermal governor"
148 help
149 Enable this to manage platform thermals using fair-share governor.
150
151config THERMAL_GOV_STEP_WISE
152 bool "Step_wise thermal governor"
153 help
154 Enable this to manage platform thermals using a simple linear
155 governor.
156
157config THERMAL_GOV_BANG_BANG
158 bool "Bang Bang thermal governor"
159 default n
160 help
161 Enable this to manage platform thermals using bang bang governor.
162
163 Say 'Y' here if you want to use two point temperature regulation
164 used for fans without throttling. Some fan drivers depend on this
165 governor to be enabled (e.g. acerhdf).
166
167config THERMAL_GOV_USER_SPACE
168 bool "User_space thermal governor"
169 help
170 Enable this to let the user space manage the platform thermals.
171
172config THERMAL_GOV_POWER_ALLOCATOR
173 bool "Power allocator thermal governor"
174 depends on ENERGY_MODEL
175 help
176 Enable this to manage platform thermals by dynamically
177 allocating and limiting power to devices.
178
179config CPU_THERMAL
180 bool "Generic cpu cooling support"
181 depends on THERMAL_OF
182 help
183 Enable the CPU cooling features. If the system has no active
184 cooling device available, this option allows to use the CPU
185 as a cooling device.
186
187if CPU_THERMAL
188
189config CPU_FREQ_THERMAL
190 bool "CPU frequency cooling device"
191 depends on CPU_FREQ
192 default y
193 help
194 This implements the generic cpu cooling mechanism through frequency
195 reduction. An ACPI version of this already exists
196 (drivers/acpi/processor_thermal.c).
197 This will be useful for platforms using the generic thermal interface
198 and not the ACPI interface.
199
200config CPU_IDLE_THERMAL
201 bool "CPU idle cooling device"
202 depends on IDLE_INJECT
203 help
204 This implements the CPU cooling mechanism through
205 idle injection. This will throttle the CPU by injecting
206 idle cycle.
207endif
208
209config DEVFREQ_THERMAL
210 bool "Generic device cooling support"
211 depends on PM_DEVFREQ
212 depends on PM_OPP
213 help
214 This implements the generic devfreq cooling mechanism through
215 frequency reduction for devices using devfreq.
216
217 This will throttle the device by limiting the maximum allowed DVFS
218 frequency corresponding to the cooling level.
219
220 In order to use the power extensions of the cooling device,
221 devfreq should use the simple_ondemand governor.
222
223 If you want this support, you should say Y here.
224
225config THERMAL_EMULATION
226 bool "Thermal emulation mode support"
227 help
228 Enable this option to make a emul_temp sysfs node in thermal zone
229 directory to support temperature emulation. With emulation sysfs node,
230 user can manually input temperature and test the different trip
231 threshold behaviour for simulation purpose.
232
233 WARNING: Be careful while enabling this option on production systems,
234 because userland can easily disable the thermal policy by simply
235 flooding this sysfs node with low temperature values.
236
237config THERMAL_MMIO
238 tristate "Generic Thermal MMIO driver"
239 depends on OF
240 depends on HAS_IOMEM
241 help
242 This option enables the generic thermal MMIO driver that will use
243 memory-mapped reads to get the temperature. Any HW/System that
244 allows temperature reading by a single memory-mapped reading, be it
245 register or shared memory, is a potential candidate to work with this
246 driver.
247
248config HISI_THERMAL
249 tristate "Hisilicon thermal driver"
250 depends on ARCH_HISI || COMPILE_TEST
251 depends on HAS_IOMEM
252 depends on OF
253 default y
254 help
255 Enable this to plug hisilicon's thermal sensor driver into the Linux
256 thermal framework. cpufreq is used as the cooling device to throttle
257 CPUs when the passive trip is crossed.
258
259config IMX_THERMAL
260 tristate "Temperature sensor driver for Freescale i.MX SoCs"
261 depends on ARCH_MXC || COMPILE_TEST
262 depends on NVMEM || !NVMEM
263 depends on MFD_SYSCON
264 depends on OF
265 help
266 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
267 It supports one critical trip point and one passive trip point. The
268 cpufreq is used as the cooling device to throttle CPUs when the
269 passive trip is crossed.
270
271config IMX_SC_THERMAL
272 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
273 depends on IMX_SCU
274 depends on OF
275 help
276 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
277 system controller inside, Linux kernel has to communicate with system
278 controller via MU (message unit) IPC to get temperature from thermal
279 sensor. It supports one critical trip point and one
280 passive trip point for each thermal sensor.
281
282config IMX8MM_THERMAL
283 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
284 depends on ARCH_MXC || COMPILE_TEST
285 depends on OF
286 help
287 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
288 It supports one critical trip point and one passive trip point. The
289 cpufreq is used as the cooling device to throttle CPUs when the passive
290 trip is crossed.
291
292config K3_THERMAL
293 tristate "Texas Instruments K3 thermal support"
294 depends on ARCH_K3 || COMPILE_TEST
295 help
296 If you say yes here you get thermal support for the Texas Instruments
297 K3 SoC family. The current chip supported is:
298 - AM654
299
300 This includes temperature reading functionality.
301
302config MAX77620_THERMAL
303 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
304 depends on MFD_MAX77620
305 depends on OF
306 help
307 Support for die junction temperature warning alarm for Maxim
308 Semiconductor PMIC MAX77620 device. Device generates two alarm
309 interrupts when PMIC die temperature cross the threshold of
310 120 degC and 140 degC.
311
312config QORIQ_THERMAL
313 tristate "QorIQ Thermal Monitoring Unit"
314 depends on THERMAL_OF && HAS_IOMEM
315 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
316 select REGMAP_MMIO
317 help
318 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
319 It supports one critical trip point and one passive trip point. The
320 cpufreq is used as the cooling device to throttle CPUs when the
321 passive trip is crossed.
322
323config SPEAR_THERMAL
324 tristate "SPEAr thermal sensor driver"
325 depends on PLAT_SPEAR || COMPILE_TEST
326 depends on HAS_IOMEM
327 depends on OF
328 help
329 Enable this to plug the SPEAr thermal sensor driver into the Linux
330 thermal framework.
331
332config SUN8I_THERMAL
333 tristate "Allwinner sun8i thermal driver"
334 depends on ARCH_SUNXI || COMPILE_TEST
335 depends on HAS_IOMEM
336 depends on NVMEM
337 depends on OF
338 depends on RESET_CONTROLLER
339 help
340 Support for the sun8i thermal sensor driver into the Linux thermal
341 framework.
342
343 To compile this driver as a module, choose M here: the
344 module will be called sun8i-thermal.
345
346config ROCKCHIP_THERMAL
347 tristate "Rockchip thermal driver"
348 depends on ARCH_ROCKCHIP || COMPILE_TEST
349 depends on RESET_CONTROLLER
350 depends on HAS_IOMEM
351 help
352 Rockchip thermal driver provides support for Temperature sensor
353 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
354 trip point. Cpufreq is used as the cooling device and will throttle
355 CPUs when the Temperature crosses the passive trip point.
356
357config RCAR_THERMAL
358 tristate "Renesas R-Car thermal driver"
359 depends on ARCH_RENESAS || COMPILE_TEST
360 depends on HAS_IOMEM
361 help
362 Enable this to plug the R-Car thermal sensor driver into the Linux
363 thermal framework.
364
365config RCAR_GEN3_THERMAL
366 tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
367 depends on ARCH_RENESAS || COMPILE_TEST
368 depends on HAS_IOMEM
369 depends on OF
370 help
371 Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
372 the Linux thermal framework.
373
374config RZG2L_THERMAL
375 tristate "Renesas RZ/G2L thermal driver"
376 depends on ARCH_RENESAS || COMPILE_TEST
377 depends on HAS_IOMEM
378 depends on OF
379 help
380 Enable this to plug the RZ/G2L thermal sensor driver into the Linux
381 thermal framework.
382
383config KIRKWOOD_THERMAL
384 tristate "Temperature sensor on Marvell Kirkwood SoCs"
385 depends on MACH_KIRKWOOD || COMPILE_TEST
386 depends on HAS_IOMEM
387 depends on OF
388 help
389 Support for the Kirkwood thermal sensor driver into the Linux thermal
390 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
391
392config DOVE_THERMAL
393 tristate "Temperature sensor on Marvell Dove SoCs"
394 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
395 depends on HAS_IOMEM
396 depends on OF
397 help
398 Support for the Dove thermal sensor driver in the Linux thermal
399 framework.
400
401config DB8500_THERMAL
402 tristate "DB8500 thermal management"
403 depends on MFD_DB8500_PRCMU && OF
404 default y
405 help
406 Adds DB8500 thermal management implementation according to the thermal
407 management framework. A thermal zone with several trip points will be
408 created. Cooling devices can be bound to the trip points to cool this
409 thermal zone if trip points reached.
410
411config ARMADA_THERMAL
412 tristate "Marvell EBU Armada SoCs thermal management"
413 depends on ARCH_MVEBU || COMPILE_TEST
414 depends on HAS_IOMEM
415 depends on OF
416 help
417 Enable this option if you want to have support for thermal management
418 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
419
420config DA9062_THERMAL
421 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
422 depends on MFD_DA9062 || COMPILE_TEST
423 depends on OF
424 help
425 Enable this for the Dialog Semiconductor thermal sensor driver.
426 This will report PMIC junction over-temperature for one thermal trip
427 zone.
428 Compatible with the DA9062 and DA9061 PMICs.
429
430menu "Mediatek thermal drivers"
431depends on ARCH_MEDIATEK || COMPILE_TEST
432source "drivers/thermal/mediatek/Kconfig"
433endmenu
434
435config AMLOGIC_THERMAL
436 tristate "Amlogic Thermal Support"
437 default ARCH_MESON
438 depends on OF && ARCH_MESON
439 help
440 If you say yes here you get support for Amlogic Thermal
441 for G12 SoC Family.
442
443 This driver can also be built as a module. If so, the module will
444 be called amlogic_thermal.
445
446menu "Intel thermal drivers"
447depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
448source "drivers/thermal/intel/Kconfig"
449endmenu
450
451menu "Broadcom thermal drivers"
452depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
453 COMPILE_TEST
454source "drivers/thermal/broadcom/Kconfig"
455endmenu
456
457menu "Texas Instruments thermal drivers"
458depends on ARCH_HAS_BANDGAP || COMPILE_TEST
459depends on HAS_IOMEM
460source "drivers/thermal/ti-soc-thermal/Kconfig"
461endmenu
462
463menu "Samsung thermal drivers"
464depends on ARCH_EXYNOS || COMPILE_TEST
465source "drivers/thermal/samsung/Kconfig"
466endmenu
467
468menu "STMicroelectronics thermal drivers"
469depends on (ARCH_STI || ARCH_STM32) && OF
470source "drivers/thermal/st/Kconfig"
471endmenu
472
473source "drivers/thermal/tegra/Kconfig"
474
475config GENERIC_ADC_THERMAL
476 tristate "Generic ADC based thermal sensor"
477 depends on IIO
478 help
479 This enabled a thermal sysfs driver for the temperature sensor
480 which is connected to the General Purpose ADC. The ADC channel
481 is read via IIO framework and the channel information is provided
482 to this driver. This driver reports the temperature by reading ADC
483 channel and converts it to temperature based on lookup table.
484
485menu "Qualcomm thermal drivers"
486depends on (ARCH_QCOM && OF) || COMPILE_TEST
487source "drivers/thermal/qcom/Kconfig"
488endmenu
489
490config UNIPHIER_THERMAL
491 tristate "Socionext UniPhier thermal driver"
492 depends on ARCH_UNIPHIER || COMPILE_TEST
493 depends on THERMAL_OF && MFD_SYSCON
494 help
495 Enable this to plug in UniPhier on-chip PVT thermal driver into the
496 thermal framework. The driver supports CPU thermal zone temperature
497 reporting and a couple of trip points.
498
499config SPRD_THERMAL
500 tristate "Temperature sensor on Spreadtrum SoCs"
501 depends on ARCH_SPRD || COMPILE_TEST
502 help
503 Support for the Spreadtrum thermal sensor driver in the Linux thermal
504 framework.
505
506config KHADAS_MCU_FAN_THERMAL
507 tristate "Khadas MCU controller FAN cooling support"
508 depends on OF
509 depends on MFD_KHADAS_MCU
510 select MFD_CORE
511 select REGMAP
512 help
513 If you say yes here you get support for the FAN controlled
514 by the Microcontroller found on the Khadas VIM boards.
515
516config LOONGSON2_THERMAL
517 tristate "Loongson-2 SoC series thermal driver"
518 depends on LOONGARCH || COMPILE_TEST
519 depends on OF
520 help
521 Support for Thermal driver found on Loongson-2 SoC series platforms.
522 The thermal driver realizes get_temp and set_trips function, which
523 are used to obtain the temperature of the current node and set the
524 temperature range to trigger the interrupt. When the input temperature
525 is higher than the high temperature threshold or lower than the low
526 temperature threshold, the interrupt will occur.
527
528endif
1#
2# Generic thermal sysfs drivers configuration
3#
4
5menuconfig THERMAL
6 tristate "Generic Thermal sysfs driver"
7 help
8 Generic Thermal Sysfs driver offers a generic mechanism for
9 thermal management. Usually it's made up of one or more thermal
10 zone and cooling device.
11 Each thermal zone contains its own temperature, trip points,
12 cooling devices.
13 All platforms with ACPI thermal support can use this driver.
14 If you want this support, you should say Y or M here.
15
16if THERMAL
17
18config THERMAL_HWMON
19 bool
20 prompt "Expose thermal sensors as hwmon device"
21 depends on HWMON=y || HWMON=THERMAL
22 default y
23 help
24 In case a sensor is registered with the thermal
25 framework, this option will also register it
26 as a hwmon. The sensor will then have the common
27 hwmon sysfs interface.
28
29 Say 'Y' here if you want all thermal sensors to
30 have hwmon sysfs interface too.
31
32config THERMAL_OF
33 bool
34 prompt "APIs to parse thermal data out of device tree"
35 depends on OF
36 default y
37 help
38 This options provides helpers to add the support to
39 read and parse thermal data definitions out of the
40 device tree blob.
41
42 Say 'Y' here if you need to build thermal infrastructure
43 based on device tree.
44
45choice
46 prompt "Default Thermal governor"
47 default THERMAL_DEFAULT_GOV_STEP_WISE
48 help
49 This option sets which thermal governor shall be loaded at
50 startup. If in doubt, select 'step_wise'.
51
52config THERMAL_DEFAULT_GOV_STEP_WISE
53 bool "step_wise"
54 select THERMAL_GOV_STEP_WISE
55 help
56 Use the step_wise governor as default. This throttles the
57 devices one step at a time.
58
59config THERMAL_DEFAULT_GOV_FAIR_SHARE
60 bool "fair_share"
61 select THERMAL_GOV_FAIR_SHARE
62 help
63 Use the fair_share governor as default. This throttles the
64 devices based on their 'contribution' to a zone. The
65 contribution should be provided through platform data.
66
67config THERMAL_DEFAULT_GOV_USER_SPACE
68 bool "user_space"
69 select THERMAL_GOV_USER_SPACE
70 help
71 Select this if you want to let the user space manage the
72 platform thermals.
73
74endchoice
75
76config THERMAL_GOV_FAIR_SHARE
77 bool "Fair-share thermal governor"
78 help
79 Enable this to manage platform thermals using fair-share governor.
80
81config THERMAL_GOV_STEP_WISE
82 bool "Step_wise thermal governor"
83 help
84 Enable this to manage platform thermals using a simple linear
85 governor.
86
87config THERMAL_GOV_USER_SPACE
88 bool "User_space thermal governor"
89 help
90 Enable this to let the user space manage the platform thermals.
91
92config CPU_THERMAL
93 bool "generic cpu cooling support"
94 depends on CPU_FREQ
95 depends on THERMAL_OF
96 help
97 This implements the generic cpu cooling mechanism through frequency
98 reduction. An ACPI version of this already exists
99 (drivers/acpi/processor_thermal.c).
100 This will be useful for platforms using the generic thermal interface
101 and not the ACPI interface.
102
103 If you want this support, you should say Y here.
104
105config THERMAL_EMULATION
106 bool "Thermal emulation mode support"
107 help
108 Enable this option to make a emul_temp sysfs node in thermal zone
109 directory to support temperature emulation. With emulation sysfs node,
110 user can manually input temperature and test the different trip
111 threshold behaviour for simulation purpose.
112
113 WARNING: Be careful while enabling this option on production systems,
114 because userland can easily disable the thermal policy by simply
115 flooding this sysfs node with low temperature values.
116
117config IMX_THERMAL
118 tristate "Temperature sensor driver for Freescale i.MX SoCs"
119 depends on CPU_THERMAL
120 depends on MFD_SYSCON
121 depends on OF
122 help
123 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
124 It supports one critical trip point and one passive trip point. The
125 cpufreq is used as the cooling device to throttle CPUs when the
126 passive trip is crossed.
127
128config SPEAR_THERMAL
129 bool "SPEAr thermal sensor driver"
130 depends on PLAT_SPEAR
131 depends on OF
132 help
133 Enable this to plug the SPEAr thermal sensor driver into the Linux
134 thermal framework.
135
136config RCAR_THERMAL
137 tristate "Renesas R-Car thermal driver"
138 depends on ARCH_SHMOBILE || COMPILE_TEST
139 depends on HAS_IOMEM
140 help
141 Enable this to plug the R-Car thermal sensor driver into the Linux
142 thermal framework.
143
144config KIRKWOOD_THERMAL
145 tristate "Temperature sensor on Marvell Kirkwood SoCs"
146 depends on ARCH_KIRKWOOD || MACH_KIRKWOOD
147 depends on OF
148 help
149 Support for the Kirkwood thermal sensor driver into the Linux thermal
150 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
151
152config DOVE_THERMAL
153 tristate "Temperature sensor on Marvell Dove SoCs"
154 depends on ARCH_DOVE
155 depends on OF
156 help
157 Support for the Dove thermal sensor driver in the Linux thermal
158 framework.
159
160config DB8500_THERMAL
161 bool "DB8500 thermal management"
162 depends on ARCH_U8500
163 default y
164 help
165 Adds DB8500 thermal management implementation according to the thermal
166 management framework. A thermal zone with several trip points will be
167 created. Cooling devices can be bound to the trip points to cool this
168 thermal zone if trip points reached.
169
170config ARMADA_THERMAL
171 tristate "Armada 370/XP thermal management"
172 depends on ARCH_MVEBU
173 depends on OF
174 help
175 Enable this option if you want to have support for thermal management
176 controller present in Armada 370 and Armada XP SoC.
177
178config DB8500_CPUFREQ_COOLING
179 tristate "DB8500 cpufreq cooling"
180 depends on ARCH_U8500
181 depends on CPU_THERMAL
182 default y
183 help
184 Adds DB8500 cpufreq cooling devices, and these cooling devices can be
185 bound to thermal zone trip points. When a trip point reached, the
186 bound cpufreq cooling device turns active to set CPU frequency low to
187 cool down the CPU.
188
189config INTEL_POWERCLAMP
190 tristate "Intel PowerClamp idle injection driver"
191 depends on THERMAL
192 depends on X86
193 depends on CPU_SUP_INTEL
194 help
195 Enable this to enable Intel PowerClamp idle injection driver. This
196 enforce idle time which results in more package C-state residency. The
197 user interface is exposed via generic thermal framework.
198
199config X86_PKG_TEMP_THERMAL
200 tristate "X86 package temperature thermal driver"
201 depends on X86_THERMAL_VECTOR
202 select THERMAL_GOV_USER_SPACE
203 default m
204 help
205 Enable this to register CPU digital sensor for package temperature as
206 thermal zone. Each package will have its own thermal zone. There are
207 two trip points which can be set by user to get notifications via thermal
208 notification methods.
209
210config ACPI_INT3403_THERMAL
211 tristate "ACPI INT3403 thermal driver"
212 depends on X86 && ACPI
213 help
214 Newer laptops and tablets that use ACPI may have thermal sensors
215 outside the core CPU/SOC for thermal safety reasons. These
216 temperature sensors are also exposed for the OS to use via the so
217 called INT3403 ACPI object. This driver will, on devices that have
218 such sensors, expose the temperature information from these sensors
219 to userspace via the normal thermal framework. This means that a wide
220 range of applications and GUI widgets can show this information to
221 the user or use this information for making decisions. For example,
222 the Intel Thermal Daemon can use this information to allow the user
223 to select his laptop to run without turning on the fans.
224
225menu "Texas Instruments thermal drivers"
226source "drivers/thermal/ti-soc-thermal/Kconfig"
227endmenu
228
229menu "Samsung thermal drivers"
230depends on PLAT_SAMSUNG
231source "drivers/thermal/samsung/Kconfig"
232endmenu
233
234endif