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v3.15
 
  1#
  2# Generic thermal sysfs drivers configuration
  3#
  4
  5menuconfig THERMAL
  6	tristate "Generic Thermal sysfs driver"
  7	help
  8	  Generic Thermal Sysfs driver offers a generic mechanism for
  9	  thermal management. Usually it's made up of one or more thermal
 10	  zone and cooling device.
 11	  Each thermal zone contains its own temperature, trip points,
 12	  cooling devices.
 13	  All platforms with ACPI thermal support can use this driver.
 14	  If you want this support, you should say Y or M here.
 
 15
 16if THERMAL
 17
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 18config THERMAL_HWMON
 19	bool
 20	prompt "Expose thermal sensors as hwmon device"
 21	depends on HWMON=y || HWMON=THERMAL
 22	default y
 23	help
 24	  In case a sensor is registered with the thermal
 25	  framework, this option will also register it
 26	  as a hwmon. The sensor will then have the common
 27	  hwmon sysfs interface.
 28
 29	  Say 'Y' here if you want all thermal sensors to
 30	  have hwmon sysfs interface too.
 31
 32config THERMAL_OF
 33	bool
 34	prompt "APIs to parse thermal data out of device tree"
 35	depends on OF
 36	default y
 37	help
 38	  This options provides helpers to add the support to
 39	  read and parse thermal data definitions out of the
 40	  device tree blob.
 41
 42	  Say 'Y' here if you need to build thermal infrastructure
 43	  based on device tree.
 44
 45choice
 46	prompt "Default Thermal governor"
 47	default THERMAL_DEFAULT_GOV_STEP_WISE
 48	help
 49	  This option sets which thermal governor shall be loaded at
 50	  startup. If in doubt, select 'step_wise'.
 51
 52config THERMAL_DEFAULT_GOV_STEP_WISE
 53	bool "step_wise"
 54	select THERMAL_GOV_STEP_WISE
 55	help
 56	  Use the step_wise governor as default. This throttles the
 57	  devices one step at a time.
 58
 59config THERMAL_DEFAULT_GOV_FAIR_SHARE
 60	bool "fair_share"
 61	select THERMAL_GOV_FAIR_SHARE
 62	help
 63	  Use the fair_share governor as default. This throttles the
 64	  devices based on their 'contribution' to a zone. The
 65	  contribution should be provided through platform data.
 66
 67config THERMAL_DEFAULT_GOV_USER_SPACE
 68	bool "user_space"
 69	select THERMAL_GOV_USER_SPACE
 70	help
 71	  Select this if you want to let the user space manage the
 72	  platform thermals.
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 73
 74endchoice
 75
 76config THERMAL_GOV_FAIR_SHARE
 77	bool "Fair-share thermal governor"
 78	help
 79	  Enable this to manage platform thermals using fair-share governor.
 80
 81config THERMAL_GOV_STEP_WISE
 82	bool "Step_wise thermal governor"
 83	help
 84	  Enable this to manage platform thermals using a simple linear
 85	  governor.
 86
 
 
 
 
 
 
 
 
 
 
 87config THERMAL_GOV_USER_SPACE
 88	bool "User_space thermal governor"
 89	help
 90	  Enable this to let the user space manage the platform thermals.
 91
 
 
 
 
 
 
 
 92config CPU_THERMAL
 93	bool "generic cpu cooling support"
 94	depends on CPU_FREQ
 95	depends on THERMAL_OF
 96	help
 
 
 
 
 
 
 
 
 
 
 
 97	  This implements the generic cpu cooling mechanism through frequency
 98	  reduction. An ACPI version of this already exists
 99	  (drivers/acpi/processor_thermal.c).
100	  This will be useful for platforms using the generic thermal interface
101	  and not the ACPI interface.
102
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
103	  If you want this support, you should say Y here.
104
105config THERMAL_EMULATION
106	bool "Thermal emulation mode support"
107	help
108	  Enable this option to make a emul_temp sysfs node in thermal zone
109	  directory to support temperature emulation. With emulation sysfs node,
110	  user can manually input temperature and test the different trip
111	  threshold behaviour for simulation purpose.
112
113	  WARNING: Be careful while enabling this option on production systems,
114	  because userland can easily disable the thermal policy by simply
115	  flooding this sysfs node with low temperature values.
116
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
117config IMX_THERMAL
118	tristate "Temperature sensor driver for Freescale i.MX SoCs"
119	depends on CPU_THERMAL
 
120	depends on MFD_SYSCON
121	depends on OF
122	help
123	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
124	  It supports one critical trip point and one passive trip point.  The
125	  cpufreq is used as the cooling device to throttle CPUs when the
126	  passive trip is crossed.
127
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
128config SPEAR_THERMAL
129	bool "SPEAr thermal sensor driver"
130	depends on PLAT_SPEAR
 
131	depends on OF
132	help
133	  Enable this to plug the SPEAr thermal sensor driver into the Linux
134	  thermal framework.
135
136config RCAR_THERMAL
137	tristate "Renesas R-Car thermal driver"
138	depends on ARCH_SHMOBILE || COMPILE_TEST
139	depends on HAS_IOMEM
 
 
 
140	help
141	  Enable this to plug the R-Car thermal sensor driver into the Linux
142	  thermal framework.
 
 
 
 
 
 
 
 
 
 
 
 
 
 
143
144config KIRKWOOD_THERMAL
145	tristate "Temperature sensor on Marvell Kirkwood SoCs"
146	depends on ARCH_KIRKWOOD || MACH_KIRKWOOD
 
147	depends on OF
148	help
149	  Support for the Kirkwood thermal sensor driver into the Linux thermal
150	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
151
152config DOVE_THERMAL
153	tristate "Temperature sensor on Marvell Dove SoCs"
154	depends on ARCH_DOVE
 
155	depends on OF
156	help
157	  Support for the Dove thermal sensor driver in the Linux thermal
158	  framework.
159
160config DB8500_THERMAL
161	bool "DB8500 thermal management"
162	depends on ARCH_U8500
163	default y
164	help
165	  Adds DB8500 thermal management implementation according to the thermal
166	  management framework. A thermal zone with several trip points will be
167	  created. Cooling devices can be bound to the trip points to cool this
168	  thermal zone if trip points reached.
169
170config ARMADA_THERMAL
171	tristate "Armada 370/XP thermal management"
172	depends on ARCH_MVEBU
 
173	depends on OF
174	help
175	  Enable this option if you want to have support for thermal management
176	  controller present in Armada 370 and Armada XP SoC.
177
178config DB8500_CPUFREQ_COOLING
179	tristate "DB8500 cpufreq cooling"
180	depends on ARCH_U8500
181	depends on CPU_THERMAL
182	default y
183	help
184	  Adds DB8500 cpufreq cooling devices, and these cooling devices can be
185	  bound to thermal zone trip points. When a trip point reached, the
186	  bound cpufreq cooling device turns active to set CPU frequency low to
187	  cool down the CPU.
188
189config INTEL_POWERCLAMP
190	tristate "Intel PowerClamp idle injection driver"
191	depends on THERMAL
192	depends on X86
193	depends on CPU_SUP_INTEL
194	help
195	  Enable this to enable Intel PowerClamp idle injection driver. This
196	  enforce idle time which results in more package C-state residency. The
197	  user interface is exposed via generic thermal framework.
198
199config X86_PKG_TEMP_THERMAL
200	tristate "X86 package temperature thermal driver"
201	depends on X86_THERMAL_VECTOR
202	select THERMAL_GOV_USER_SPACE
203	default m
204	help
205	  Enable this to register CPU digital sensor for package temperature as
206	  thermal zone. Each package will have its own thermal zone. There are
207	  two trip points which can be set by user to get notifications via thermal
208	  notification methods.
209
210config ACPI_INT3403_THERMAL
211	tristate "ACPI INT3403 thermal driver"
212	depends on X86 && ACPI
213	help
214	  Newer laptops and tablets that use ACPI may have thermal sensors
215	  outside the core CPU/SOC for thermal safety reasons. These
216	  temperature sensors are also exposed for the OS to use via the so
217	  called INT3403 ACPI object. This driver will, on devices that have
218	  such sensors, expose the temperature information from these sensors
219	  to userspace via the normal thermal framework. This means that a wide
220	  range of applications and GUI widgets can show this information to
221	  the user or use this information for making decisions. For example,
222	  the Intel Thermal Daemon can use this information to allow the user
223	  to select his laptop to run without turning on the fans.
 
 
 
 
 
 
 
 
 
 
 
 
224
225menu "Texas Instruments thermal drivers"
 
 
226source "drivers/thermal/ti-soc-thermal/Kconfig"
227endmenu
228
229menu "Samsung thermal drivers"
230depends on PLAT_SAMSUNG
231source "drivers/thermal/samsung/Kconfig"
232endmenu
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
233
234endif
v6.13.7
  1# SPDX-License-Identifier: GPL-2.0-only
  2#
  3# Generic thermal drivers configuration
  4#
  5
  6menuconfig THERMAL
  7	bool "Thermal drivers"
  8	help
  9	  Thermal drivers offer a generic mechanism for
 10	  thermal management. Usually it's made up of one or more thermal
 11	  zones and cooling devices.
 12	  Each thermal zone contains its own temperature, trip points,
 13	  and cooling devices.
 14	  All platforms with ACPI or Open Firmware thermal support can use
 15	  this driver.
 16	  If you want this support, you should say Y here.
 17
 18if THERMAL
 19
 20config THERMAL_NETLINK
 21	bool "Thermal netlink management"
 22	depends on NET
 23	help
 24	  The thermal framework has a netlink interface to do thermal
 25	  zones discovery, temperature readings and events such as
 26	  trip point crossed, cooling device update or governor
 27	  change. It is recommended to enable the feature.
 28
 29config THERMAL_STATISTICS
 30	bool "Thermal state transition statistics"
 31	help
 32	  Export thermal state transition statistics information through sysfs.
 33
 34	  If in doubt, say N.
 35
 36config THERMAL_DEBUGFS
 37	bool "Thermal subsystem debug support"
 38	depends on DEBUG_FS
 39	help
 40	  Say Y to allow the thermal subsystem to collect diagnostic
 41	  information that can be accessed via debugfs.
 42
 43config THERMAL_CORE_TESTING
 44	tristate "Thermal core testing facility"
 45	depends on DEBUG_FS
 46	help
 47	  Say Y to add a debugfs-based thermal core testing facility.
 48	  It allows test thermal zones to be created and populated
 49	  with trip points in order to exercise the thermal core
 50	  functionality in a controlled way.
 51
 52config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
 53	int "Emergency poweroff delay in milli-seconds"
 54	default 0
 55	help
 56	  Thermal subsystem will issue a graceful shutdown when
 57	  critical temperatures are reached using orderly_poweroff(). In
 58	  case of failure of an orderly_poweroff(), the thermal emergency
 59	  poweroff kicks in after a delay has elapsed and shuts down the system.
 60	  This config is number of milliseconds to delay before emergency
 61	  poweroff kicks in. Similarly to the critical trip point,
 62	  the delay should be carefully profiled so as to give adequate
 63	  time for orderly_poweroff() to finish on regular execution.
 64	  If set to 0 emergency poweroff will not be supported.
 65
 66	  In doubt, leave as 0.
 67
 68config THERMAL_HWMON
 69	bool
 70	prompt "Expose thermal sensors as hwmon device"
 71	depends on HWMON=y || HWMON=THERMAL
 72	default y
 73	help
 74	  In case a sensor is registered with the thermal
 75	  framework, this option will also register it
 76	  as a hwmon. The sensor will then have the common
 77	  hwmon sysfs interface.
 78
 79	  Say 'Y' here if you want all thermal sensors to
 80	  have hwmon sysfs interface too.
 81
 82config THERMAL_OF
 83	bool
 84	prompt "APIs to parse thermal data out of device tree"
 85	depends on OF
 86	default y
 87	help
 88	  This options provides helpers to add the support to
 89	  read and parse thermal data definitions out of the
 90	  device tree blob.
 91
 92	  Say 'Y' here if you need to build thermal infrastructure
 93	  based on device tree.
 94
 95choice
 96	prompt "Default Thermal governor"
 97	default THERMAL_DEFAULT_GOV_STEP_WISE
 98	help
 99	  This option sets which thermal governor shall be loaded at
100	  startup. If in doubt, select 'step_wise'.
101
102config THERMAL_DEFAULT_GOV_STEP_WISE
103	bool "step_wise"
104	select THERMAL_GOV_STEP_WISE
105	help
106	  Use the step_wise governor as default. This throttles the
107	  devices one step at a time.
108
109config THERMAL_DEFAULT_GOV_FAIR_SHARE
110	bool "fair_share"
111	select THERMAL_GOV_FAIR_SHARE
112	help
113	  Use the fair_share governor as default. This throttles the
114	  devices based on their 'contribution' to a zone. The
115	  contribution should be provided through platform data.
116
117config THERMAL_DEFAULT_GOV_USER_SPACE
118	bool "user_space"
119	select THERMAL_GOV_USER_SPACE
120	help
121	  The Userspace governor allows to get trip point crossed
122	  notification from the kernel via uevents. It is recommended
123	  to use the netlink interface instead which gives richer
124	  information about the thermal framework events.
125
126config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
127	bool "power_allocator"
128	depends on THERMAL_GOV_POWER_ALLOCATOR
129	help
130	  Select this if you want to control temperature based on
131	  system and device power allocation. This governor can only
132	  operate on cooling devices that implement the power API.
133
134config THERMAL_DEFAULT_GOV_BANG_BANG
135	bool "bang_bang"
136	depends on THERMAL_GOV_BANG_BANG
137	help
138	  Use the bang_bang governor as default. This throttles the
139	  devices one step at the time, taking into account the trip
140	  point hysteresis.
141
142endchoice
143
144config THERMAL_GOV_FAIR_SHARE
145	bool "Fair-share thermal governor"
146	help
147	  Enable this to manage platform thermals using fair-share governor.
148
149config THERMAL_GOV_STEP_WISE
150	bool "Step_wise thermal governor"
151	help
152	  Enable this to manage platform thermals using a simple linear
153	  governor.
154
155config THERMAL_GOV_BANG_BANG
156	bool "Bang Bang thermal governor"
157	default n
158	help
159	  Enable this to manage platform thermals using bang bang governor.
160
161	  Say 'Y' here if you want to use two point temperature regulation
162	  used for fans without throttling.  Some fan drivers depend on this
163	  governor to be enabled (e.g. acerhdf).
164
165config THERMAL_GOV_USER_SPACE
166	bool "User_space thermal governor"
167	help
168	  Enable this to let the user space manage the platform thermals.
169
170config THERMAL_GOV_POWER_ALLOCATOR
171	bool "Power allocator thermal governor"
172	depends on ENERGY_MODEL
173	help
174	  Enable this to manage platform thermals by dynamically
175	  allocating and limiting power to devices.
176
177config CPU_THERMAL
178	bool "Generic cpu cooling support"
 
179	depends on THERMAL_OF
180	help
181	  Enable the CPU cooling features. If the system has no active
182	  cooling device available, this option allows to use the CPU
183	  as a cooling device.
184
185if CPU_THERMAL
186
187config CPU_FREQ_THERMAL
188	bool "CPU frequency cooling device"
189	depends on CPU_FREQ
190	default y
191	help
192	  This implements the generic cpu cooling mechanism through frequency
193	  reduction. An ACPI version of this already exists
194	  (drivers/acpi/processor_thermal.c).
195	  This will be useful for platforms using the generic thermal interface
196	  and not the ACPI interface.
197
198config CPU_IDLE_THERMAL
199	bool "CPU idle cooling device"
200	depends on IDLE_INJECT
201	help
202	  This implements the CPU cooling mechanism through
203	  idle injection. This will throttle the CPU by injecting
204	  idle cycle.
205endif
206
207config DEVFREQ_THERMAL
208	bool "Generic device cooling support"
209	depends on PM_DEVFREQ
210	depends on PM_OPP
211	help
212	  This implements the generic devfreq cooling mechanism through
213	  frequency reduction for devices using devfreq.
214
215	  This will throttle the device by limiting the maximum allowed DVFS
216	  frequency corresponding to the cooling level.
217
218	  In order to use the power extensions of the cooling device,
219	  devfreq should use the simple_ondemand governor.
220
221	  If you want this support, you should say Y here.
222
223config PCIE_THERMAL
224	bool "PCIe cooling support"
225	depends on PCIEPORTBUS
226	help
227	  This implements PCIe cooling mechanism through bandwidth reduction
228	  for PCIe devices.
229
230	  If you want this support, you should say Y here.
231
232config THERMAL_EMULATION
233	bool "Thermal emulation mode support"
234	help
235	  Enable this option to make a emul_temp sysfs node in thermal zone
236	  directory to support temperature emulation. With emulation sysfs node,
237	  user can manually input temperature and test the different trip
238	  threshold behaviour for simulation purpose.
239
240	  WARNING: Be careful while enabling this option on production systems,
241	  because userland can easily disable the thermal policy by simply
242	  flooding this sysfs node with low temperature values.
243
244config THERMAL_MMIO
245	tristate "Generic Thermal MMIO driver"
246	depends on OF
247	depends on HAS_IOMEM
248	help
249	  This option enables the generic thermal MMIO driver that will use
250	  memory-mapped reads to get the temperature.  Any HW/System that
251	  allows temperature reading by a single memory-mapped reading, be it
252	  register or shared memory, is a potential candidate to work with this
253	  driver.
254
255config HISI_THERMAL
256	tristate "Hisilicon thermal driver"
257	depends on ARCH_HISI || COMPILE_TEST
258	depends on HAS_IOMEM
259	depends on OF
260	default y
261	help
262	  Enable this to plug hisilicon's thermal sensor driver into the Linux
263	  thermal framework. cpufreq is used as the cooling device to throttle
264	  CPUs when the passive trip is crossed.
265
266config IMX_THERMAL
267	tristate "Temperature sensor driver for Freescale i.MX SoCs"
268	depends on ARCH_MXC || COMPILE_TEST
269	depends on NVMEM || !NVMEM
270	depends on MFD_SYSCON
271	depends on OF
272	help
273	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
274	  It supports one critical trip point and one passive trip point.  The
275	  cpufreq is used as the cooling device to throttle CPUs when the
276	  passive trip is crossed.
277
278config IMX_SC_THERMAL
279	tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
280	depends on IMX_SCU
281	depends on OF
282	help
283	  Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
284	  system controller inside, Linux kernel has to communicate with system
285	  controller via MU (message unit) IPC to get temperature from thermal
286	  sensor. It supports one critical trip point and one
287	  passive trip point for each thermal sensor.
288
289config IMX8MM_THERMAL
290	tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
291	depends on ARCH_MXC || COMPILE_TEST
292	depends on OF
293	help
294	  Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
295	  It supports one critical trip point and one passive trip point. The
296	  cpufreq is used as the cooling device to throttle CPUs when the passive
297	  trip is crossed.
298
299config K3_THERMAL
300	tristate "Texas Instruments K3 thermal support"
301	depends on ARCH_K3 || COMPILE_TEST
302	help
303	  If you say yes here you get thermal support for the Texas Instruments
304	  K3 SoC family. The current chip supported is:
305	  - AM654
306
307	  This includes temperature reading functionality.
308
309config MAX77620_THERMAL
310	tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
311	depends on MFD_MAX77620
312	depends on OF
313	help
314	  Support for die junction temperature warning alarm for Maxim
315	  Semiconductor PMIC MAX77620 device. Device generates two alarm
316	  interrupts when PMIC die temperature cross the threshold of
317	  120 degC and 140 degC.
318
319config QORIQ_THERMAL
320	tristate "QorIQ Thermal Monitoring Unit"
321	depends on THERMAL_OF && HAS_IOMEM
322	depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
323	select REGMAP_MMIO
324	help
325	  Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
326	  It supports one critical trip point and one passive trip point. The
327	  cpufreq is used as the cooling device to throttle CPUs when the
328	  passive trip is crossed.
329
330config SPEAR_THERMAL
331	tristate "SPEAr thermal sensor driver"
332	depends on PLAT_SPEAR || COMPILE_TEST
333	depends on HAS_IOMEM
334	depends on OF
335	help
336	  Enable this to plug the SPEAr thermal sensor driver into the Linux
337	  thermal framework.
338
339config SUN8I_THERMAL
340	tristate "Allwinner sun8i thermal driver"
341	depends on ARCH_SUNXI || COMPILE_TEST
342	depends on HAS_IOMEM
343	depends on NVMEM
344	depends on OF
345	depends on RESET_CONTROLLER
346	help
347	  Support for the sun8i thermal sensor driver into the Linux thermal
348	  framework.
349
350	  To compile this driver as a module, choose M here: the
351	  module will be called sun8i-thermal.
352
353config ROCKCHIP_THERMAL
354	tristate "Rockchip thermal driver"
355	depends on ARCH_ROCKCHIP || COMPILE_TEST
356	depends on RESET_CONTROLLER
357	depends on HAS_IOMEM
358	help
359	  Rockchip thermal driver provides support for Temperature sensor
360	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
361	  trip point. Cpufreq is used as the cooling device and will throttle
362	  CPUs when the Temperature crosses the passive trip point.
363
364config KIRKWOOD_THERMAL
365	tristate "Temperature sensor on Marvell Kirkwood SoCs"
366	depends on MACH_KIRKWOOD || COMPILE_TEST
367	depends on HAS_IOMEM
368	depends on OF
369	help
370	  Support for the Kirkwood thermal sensor driver into the Linux thermal
371	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
372
373config DOVE_THERMAL
374	tristate "Temperature sensor on Marvell Dove SoCs"
375	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
376	depends on HAS_IOMEM
377	depends on OF
378	help
379	  Support for the Dove thermal sensor driver in the Linux thermal
380	  framework.
381
382config DB8500_THERMAL
383	tristate "DB8500 thermal management"
384	depends on MFD_DB8500_PRCMU && OF
385	default y
386	help
387	  Adds DB8500 thermal management implementation according to the thermal
388	  management framework. A thermal zone with several trip points will be
389	  created. Cooling devices can be bound to the trip points to cool this
390	  thermal zone if trip points reached.
391
392config ARMADA_THERMAL
393	tristate "Marvell EBU Armada SoCs thermal management"
394	depends on ARCH_MVEBU || COMPILE_TEST
395	depends on HAS_IOMEM
396	depends on OF
397	help
398	  Enable this option if you want to have support for thermal management
399	  controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
400
401config DA9062_THERMAL
402	tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
403	depends on MFD_DA9062 || COMPILE_TEST
404	depends on OF
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
405	help
406	  Enable this for the Dialog Semiconductor thermal sensor driver.
407	  This will report PMIC junction over-temperature for one thermal trip
408	  zone.
409	  Compatible with the DA9062 and DA9061 PMICs.
410
411menu "Mediatek thermal drivers"
412depends on ARCH_MEDIATEK || COMPILE_TEST
413source "drivers/thermal/mediatek/Kconfig"
414endmenu
415
416config AMLOGIC_THERMAL
417	tristate "Amlogic Thermal Support"
418	default ARCH_MESON
419	depends on OF && ARCH_MESON
420	help
421	  If you say yes here you get support for Amlogic Thermal
422	  for G12 SoC Family.
423
424	  This driver can also be built as a module. If so, the module will
425	  be called amlogic_thermal.
426
427menu "Intel thermal drivers"
428depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
429source "drivers/thermal/intel/Kconfig"
430endmenu
431
432menu "Broadcom thermal drivers"
433depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
434		COMPILE_TEST
435source "drivers/thermal/broadcom/Kconfig"
436endmenu
437
438menu "Texas Instruments thermal drivers"
439depends on ARCH_HAS_BANDGAP || COMPILE_TEST
440depends on HAS_IOMEM
441source "drivers/thermal/ti-soc-thermal/Kconfig"
442endmenu
443
444menu "Samsung thermal drivers"
445depends on ARCH_EXYNOS || COMPILE_TEST
446source "drivers/thermal/samsung/Kconfig"
447endmenu
448
449menu "STMicroelectronics thermal drivers"
450depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF
451source "drivers/thermal/st/Kconfig"
452endmenu
453
454source "drivers/thermal/renesas/Kconfig"
455
456source "drivers/thermal/tegra/Kconfig"
457
458config GENERIC_ADC_THERMAL
459	tristate "Generic ADC based thermal sensor"
460	depends on IIO
461	help
462	  This enabled a thermal sysfs driver for the temperature sensor
463	  which is connected to the General Purpose ADC. The ADC channel
464	  is read via IIO framework and the channel information is provided
465	  to this driver. This driver reports the temperature by reading ADC
466	  channel and converts it to temperature based on lookup table.
467
468menu "Qualcomm thermal drivers"
469depends on (ARCH_QCOM && OF) || COMPILE_TEST
470source "drivers/thermal/qcom/Kconfig"
471endmenu
472
473config UNIPHIER_THERMAL
474	tristate "Socionext UniPhier thermal driver"
475	depends on ARCH_UNIPHIER || COMPILE_TEST
476	depends on THERMAL_OF && MFD_SYSCON
477	help
478	  Enable this to plug in UniPhier on-chip PVT thermal driver into the
479	  thermal framework. The driver supports CPU thermal zone temperature
480	  reporting and a couple of trip points.
481
482config SPRD_THERMAL
483	tristate "Temperature sensor on Spreadtrum SoCs"
484	depends on ARCH_SPRD || COMPILE_TEST
485	help
486	  Support for the Spreadtrum thermal sensor driver in the Linux thermal
487	  framework.
488
489config KHADAS_MCU_FAN_THERMAL
490	tristate "Khadas MCU controller FAN cooling support"
491	depends on OF
492	depends on MFD_KHADAS_MCU
493	select MFD_CORE
494	select REGMAP
495	help
496	  If you say yes here you get support for the FAN controlled
497	  by the Microcontroller found on the Khadas VIM boards.
498
499config LOONGSON2_THERMAL
500	tristate "Loongson-2 SoC series thermal driver"
501	depends on LOONGARCH || COMPILE_TEST
502	depends on OF
503	help
504	  Support for Thermal driver found on Loongson-2 SoC series platforms.
505	  The thermal driver realizes get_temp and set_trips function, which
506	  are used to obtain the temperature of the current node and set the
507	  temperature range to trigger the interrupt. When the input temperature
508	  is higher than the high temperature threshold or lower than the low
509	  temperature threshold, the interrupt will occur.
510
511endif