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1#
2# Generic thermal sysfs drivers configuration
3#
4
5menuconfig THERMAL
6 tristate "Generic Thermal sysfs driver"
7 help
8 Generic Thermal Sysfs driver offers a generic mechanism for
9 thermal management. Usually it's made up of one or more thermal
10 zone and cooling device.
11 Each thermal zone contains its own temperature, trip points,
12 cooling devices.
13 All platforms with ACPI thermal support can use this driver.
14 If you want this support, you should say Y or M here.
15
16config THERMAL_HWMON
17 bool
18 depends on THERMAL
19 depends on HWMON=y || HWMON=THERMAL
20 default y
1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7 bool "Thermal drivers"
8 help
9 Thermal drivers offer a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zones and cooling devices.
12 Each thermal zone contains its own temperature, trip points,
13 and cooling devices.
14 All platforms with ACPI or Open Firmware thermal support can use
15 this driver.
16 If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_NETLINK
21 bool "Thermal netlink management"
22 depends on NET
23 help
24 The thermal framework has a netlink interface to do thermal
25 zones discovery, temperature readings and events such as
26 trip point crossed, cooling device update or governor
27 change. It is recommended to enable the feature.
28
29config THERMAL_STATISTICS
30 bool "Thermal state transition statistics"
31 help
32 Export thermal state transition statistics information through sysfs.
33
34 If in doubt, say N.
35
36config THERMAL_DEBUGFS
37 bool "Thermal subsystem debug support"
38 depends on DEBUG_FS
39 help
40 Say Y to allow the thermal subsystem to collect diagnostic
41 information that can be accessed via debugfs.
42
43config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
44 int "Emergency poweroff delay in milli-seconds"
45 default 0
46 help
47 Thermal subsystem will issue a graceful shutdown when
48 critical temperatures are reached using orderly_poweroff(). In
49 case of failure of an orderly_poweroff(), the thermal emergency
50 poweroff kicks in after a delay has elapsed and shuts down the system.
51 This config is number of milliseconds to delay before emergency
52 poweroff kicks in. Similarly to the critical trip point,
53 the delay should be carefully profiled so as to give adequate
54 time for orderly_poweroff() to finish on regular execution.
55 If set to 0 emergency poweroff will not be supported.
56
57 In doubt, leave as 0.
58
59config THERMAL_HWMON
60 bool
61 prompt "Expose thermal sensors as hwmon device"
62 depends on HWMON=y || HWMON=THERMAL
63 default y
64 help
65 In case a sensor is registered with the thermal
66 framework, this option will also register it
67 as a hwmon. The sensor will then have the common
68 hwmon sysfs interface.
69
70 Say 'Y' here if you want all thermal sensors to
71 have hwmon sysfs interface too.
72
73config THERMAL_OF
74 bool
75 prompt "APIs to parse thermal data out of device tree"
76 depends on OF
77 default y
78 help
79 This options provides helpers to add the support to
80 read and parse thermal data definitions out of the
81 device tree blob.
82
83 Say 'Y' here if you need to build thermal infrastructure
84 based on device tree.
85
86choice
87 prompt "Default Thermal governor"
88 default THERMAL_DEFAULT_GOV_STEP_WISE
89 help
90 This option sets which thermal governor shall be loaded at
91 startup. If in doubt, select 'step_wise'.
92
93config THERMAL_DEFAULT_GOV_STEP_WISE
94 bool "step_wise"
95 select THERMAL_GOV_STEP_WISE
96 help
97 Use the step_wise governor as default. This throttles the
98 devices one step at a time.
99
100config THERMAL_DEFAULT_GOV_FAIR_SHARE
101 bool "fair_share"
102 select THERMAL_GOV_FAIR_SHARE
103 help
104 Use the fair_share governor as default. This throttles the
105 devices based on their 'contribution' to a zone. The
106 contribution should be provided through platform data.
107
108config THERMAL_DEFAULT_GOV_USER_SPACE
109 bool "user_space"
110 select THERMAL_GOV_USER_SPACE
111 help
112 The Userspace governor allows to get trip point crossed
113 notification from the kernel via uevents. It is recommended
114 to use the netlink interface instead which gives richer
115 information about the thermal framework events.
116
117config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
118 bool "power_allocator"
119 depends on THERMAL_GOV_POWER_ALLOCATOR
120 help
121 Select this if you want to control temperature based on
122 system and device power allocation. This governor can only
123 operate on cooling devices that implement the power API.
124
125config THERMAL_DEFAULT_GOV_BANG_BANG
126 bool "bang_bang"
127 depends on THERMAL_GOV_BANG_BANG
128 help
129 Use the bang_bang governor as default. This throttles the
130 devices one step at the time, taking into account the trip
131 point hysteresis.
132
133endchoice
134
135config THERMAL_GOV_FAIR_SHARE
136 bool "Fair-share thermal governor"
137 help
138 Enable this to manage platform thermals using fair-share governor.
139
140config THERMAL_GOV_STEP_WISE
141 bool "Step_wise thermal governor"
142 help
143 Enable this to manage platform thermals using a simple linear
144 governor.
145
146config THERMAL_GOV_BANG_BANG
147 bool "Bang Bang thermal governor"
148 default n
149 help
150 Enable this to manage platform thermals using bang bang governor.
151
152 Say 'Y' here if you want to use two point temperature regulation
153 used for fans without throttling. Some fan drivers depend on this
154 governor to be enabled (e.g. acerhdf).
155
156config THERMAL_GOV_USER_SPACE
157 bool "User_space thermal governor"
158 help
159 Enable this to let the user space manage the platform thermals.
160
161config THERMAL_GOV_POWER_ALLOCATOR
162 bool "Power allocator thermal governor"
163 depends on ENERGY_MODEL
164 help
165 Enable this to manage platform thermals by dynamically
166 allocating and limiting power to devices.
167
168config CPU_THERMAL
169 bool "Generic cpu cooling support"
170 depends on THERMAL_OF
171 help
172 Enable the CPU cooling features. If the system has no active
173 cooling device available, this option allows to use the CPU
174 as a cooling device.
175
176if CPU_THERMAL
177
178config CPU_FREQ_THERMAL
179 bool "CPU frequency cooling device"
180 depends on CPU_FREQ
181 default y
182 help
183 This implements the generic cpu cooling mechanism through frequency
184 reduction. An ACPI version of this already exists
185 (drivers/acpi/processor_thermal.c).
186 This will be useful for platforms using the generic thermal interface
187 and not the ACPI interface.
188
189config CPU_IDLE_THERMAL
190 bool "CPU idle cooling device"
191 depends on IDLE_INJECT
192 help
193 This implements the CPU cooling mechanism through
194 idle injection. This will throttle the CPU by injecting
195 idle cycle.
196endif
197
198config DEVFREQ_THERMAL
199 bool "Generic device cooling support"
200 depends on PM_DEVFREQ
201 depends on PM_OPP
202 help
203 This implements the generic devfreq cooling mechanism through
204 frequency reduction for devices using devfreq.
205
206 This will throttle the device by limiting the maximum allowed DVFS
207 frequency corresponding to the cooling level.
208
209 In order to use the power extensions of the cooling device,
210 devfreq should use the simple_ondemand governor.
211
212 If you want this support, you should say Y here.
213
214config THERMAL_EMULATION
215 bool "Thermal emulation mode support"
216 help
217 Enable this option to make a emul_temp sysfs node in thermal zone
218 directory to support temperature emulation. With emulation sysfs node,
219 user can manually input temperature and test the different trip
220 threshold behaviour for simulation purpose.
221
222 WARNING: Be careful while enabling this option on production systems,
223 because userland can easily disable the thermal policy by simply
224 flooding this sysfs node with low temperature values.
225
226config THERMAL_MMIO
227 tristate "Generic Thermal MMIO driver"
228 depends on OF
229 depends on HAS_IOMEM
230 help
231 This option enables the generic thermal MMIO driver that will use
232 memory-mapped reads to get the temperature. Any HW/System that
233 allows temperature reading by a single memory-mapped reading, be it
234 register or shared memory, is a potential candidate to work with this
235 driver.
236
237config HISI_THERMAL
238 tristate "Hisilicon thermal driver"
239 depends on ARCH_HISI || COMPILE_TEST
240 depends on HAS_IOMEM
241 depends on OF
242 default y
243 help
244 Enable this to plug hisilicon's thermal sensor driver into the Linux
245 thermal framework. cpufreq is used as the cooling device to throttle
246 CPUs when the passive trip is crossed.
247
248config IMX_THERMAL
249 tristate "Temperature sensor driver for Freescale i.MX SoCs"
250 depends on ARCH_MXC || COMPILE_TEST
251 depends on NVMEM || !NVMEM
252 depends on MFD_SYSCON
253 depends on OF
254 help
255 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
256 It supports one critical trip point and one passive trip point. The
257 cpufreq is used as the cooling device to throttle CPUs when the
258 passive trip is crossed.
259
260config IMX_SC_THERMAL
261 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
262 depends on IMX_SCU
263 depends on OF
264 help
265 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
266 system controller inside, Linux kernel has to communicate with system
267 controller via MU (message unit) IPC to get temperature from thermal
268 sensor. It supports one critical trip point and one
269 passive trip point for each thermal sensor.
270
271config IMX8MM_THERMAL
272 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
273 depends on ARCH_MXC || COMPILE_TEST
274 depends on OF
275 help
276 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
277 It supports one critical trip point and one passive trip point. The
278 cpufreq is used as the cooling device to throttle CPUs when the passive
279 trip is crossed.
280
281config K3_THERMAL
282 tristate "Texas Instruments K3 thermal support"
283 depends on ARCH_K3 || COMPILE_TEST
284 help
285 If you say yes here you get thermal support for the Texas Instruments
286 K3 SoC family. The current chip supported is:
287 - AM654
288
289 This includes temperature reading functionality.
290
291config MAX77620_THERMAL
292 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
293 depends on MFD_MAX77620
294 depends on OF
295 help
296 Support for die junction temperature warning alarm for Maxim
297 Semiconductor PMIC MAX77620 device. Device generates two alarm
298 interrupts when PMIC die temperature cross the threshold of
299 120 degC and 140 degC.
300
301config QORIQ_THERMAL
302 tristate "QorIQ Thermal Monitoring Unit"
303 depends on THERMAL_OF && HAS_IOMEM
304 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
305 select REGMAP_MMIO
306 help
307 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
308 It supports one critical trip point and one passive trip point. The
309 cpufreq is used as the cooling device to throttle CPUs when the
310 passive trip is crossed.
311
312config SPEAR_THERMAL
313 tristate "SPEAr thermal sensor driver"
314 depends on PLAT_SPEAR || COMPILE_TEST
315 depends on HAS_IOMEM
316 depends on OF
317 help
318 Enable this to plug the SPEAr thermal sensor driver into the Linux
319 thermal framework.
320
321config SUN8I_THERMAL
322 tristate "Allwinner sun8i thermal driver"
323 depends on ARCH_SUNXI || COMPILE_TEST
324 depends on HAS_IOMEM
325 depends on NVMEM
326 depends on OF
327 depends on RESET_CONTROLLER
328 help
329 Support for the sun8i thermal sensor driver into the Linux thermal
330 framework.
331
332 To compile this driver as a module, choose M here: the
333 module will be called sun8i-thermal.
334
335config ROCKCHIP_THERMAL
336 tristate "Rockchip thermal driver"
337 depends on ARCH_ROCKCHIP || COMPILE_TEST
338 depends on RESET_CONTROLLER
339 depends on HAS_IOMEM
340 help
341 Rockchip thermal driver provides support for Temperature sensor
342 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
343 trip point. Cpufreq is used as the cooling device and will throttle
344 CPUs when the Temperature crosses the passive trip point.
345
346config RCAR_THERMAL
347 tristate "Renesas R-Car thermal driver"
348 depends on ARCH_RENESAS || COMPILE_TEST
349 depends on HAS_IOMEM
350 help
351 Enable this to plug the R-Car thermal sensor driver into the Linux
352 thermal framework.
353
354config RCAR_GEN3_THERMAL
355 tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
356 depends on ARCH_RENESAS || COMPILE_TEST
357 depends on HAS_IOMEM
358 depends on OF
359 help
360 Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
361 the Linux thermal framework.
362
363config RZG2L_THERMAL
364 tristate "Renesas RZ/G2L thermal driver"
365 depends on ARCH_RENESAS || COMPILE_TEST
366 depends on HAS_IOMEM
367 depends on OF
368 help
369 Enable this to plug the RZ/G2L thermal sensor driver into the Linux
370 thermal framework.
371
372config KIRKWOOD_THERMAL
373 tristate "Temperature sensor on Marvell Kirkwood SoCs"
374 depends on MACH_KIRKWOOD || COMPILE_TEST
375 depends on HAS_IOMEM
376 depends on OF
377 help
378 Support for the Kirkwood thermal sensor driver into the Linux thermal
379 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
380
381config DOVE_THERMAL
382 tristate "Temperature sensor on Marvell Dove SoCs"
383 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
384 depends on HAS_IOMEM
385 depends on OF
386 help
387 Support for the Dove thermal sensor driver in the Linux thermal
388 framework.
389
390config DB8500_THERMAL
391 tristate "DB8500 thermal management"
392 depends on MFD_DB8500_PRCMU && OF
393 default y
394 help
395 Adds DB8500 thermal management implementation according to the thermal
396 management framework. A thermal zone with several trip points will be
397 created. Cooling devices can be bound to the trip points to cool this
398 thermal zone if trip points reached.
399
400config ARMADA_THERMAL
401 tristate "Marvell EBU Armada SoCs thermal management"
402 depends on ARCH_MVEBU || COMPILE_TEST
403 depends on HAS_IOMEM
404 depends on OF
405 help
406 Enable this option if you want to have support for thermal management
407 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
408
409config DA9062_THERMAL
410 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
411 depends on MFD_DA9062 || COMPILE_TEST
412 depends on OF
413 help
414 Enable this for the Dialog Semiconductor thermal sensor driver.
415 This will report PMIC junction over-temperature for one thermal trip
416 zone.
417 Compatible with the DA9062 and DA9061 PMICs.
418
419menu "Mediatek thermal drivers"
420depends on ARCH_MEDIATEK || COMPILE_TEST
421source "drivers/thermal/mediatek/Kconfig"
422endmenu
423
424config AMLOGIC_THERMAL
425 tristate "Amlogic Thermal Support"
426 default ARCH_MESON
427 depends on OF && ARCH_MESON
428 help
429 If you say yes here you get support for Amlogic Thermal
430 for G12 SoC Family.
431
432 This driver can also be built as a module. If so, the module will
433 be called amlogic_thermal.
434
435menu "Intel thermal drivers"
436depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
437source "drivers/thermal/intel/Kconfig"
438endmenu
439
440menu "Broadcom thermal drivers"
441depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
442 COMPILE_TEST
443source "drivers/thermal/broadcom/Kconfig"
444endmenu
445
446menu "Texas Instruments thermal drivers"
447depends on ARCH_HAS_BANDGAP || COMPILE_TEST
448depends on HAS_IOMEM
449source "drivers/thermal/ti-soc-thermal/Kconfig"
450endmenu
451
452menu "Samsung thermal drivers"
453depends on ARCH_EXYNOS || COMPILE_TEST
454source "drivers/thermal/samsung/Kconfig"
455endmenu
456
457menu "STMicroelectronics thermal drivers"
458depends on (ARCH_STI || ARCH_STM32) && OF
459source "drivers/thermal/st/Kconfig"
460endmenu
461
462source "drivers/thermal/tegra/Kconfig"
463
464config GENERIC_ADC_THERMAL
465 tristate "Generic ADC based thermal sensor"
466 depends on IIO
467 help
468 This enabled a thermal sysfs driver for the temperature sensor
469 which is connected to the General Purpose ADC. The ADC channel
470 is read via IIO framework and the channel information is provided
471 to this driver. This driver reports the temperature by reading ADC
472 channel and converts it to temperature based on lookup table.
473
474menu "Qualcomm thermal drivers"
475depends on (ARCH_QCOM && OF) || COMPILE_TEST
476source "drivers/thermal/qcom/Kconfig"
477endmenu
478
479config UNIPHIER_THERMAL
480 tristate "Socionext UniPhier thermal driver"
481 depends on ARCH_UNIPHIER || COMPILE_TEST
482 depends on THERMAL_OF && MFD_SYSCON
483 help
484 Enable this to plug in UniPhier on-chip PVT thermal driver into the
485 thermal framework. The driver supports CPU thermal zone temperature
486 reporting and a couple of trip points.
487
488config SPRD_THERMAL
489 tristate "Temperature sensor on Spreadtrum SoCs"
490 depends on ARCH_SPRD || COMPILE_TEST
491 help
492 Support for the Spreadtrum thermal sensor driver in the Linux thermal
493 framework.
494
495config KHADAS_MCU_FAN_THERMAL
496 tristate "Khadas MCU controller FAN cooling support"
497 depends on OF
498 depends on MFD_KHADAS_MCU
499 select MFD_CORE
500 select REGMAP
501 help
502 If you say yes here you get support for the FAN controlled
503 by the Microcontroller found on the Khadas VIM boards.
504
505config LOONGSON2_THERMAL
506 tristate "Loongson-2 SoC series thermal driver"
507 depends on LOONGARCH || COMPILE_TEST
508 depends on OF
509 help
510 Support for Thermal driver found on Loongson-2 SoC series platforms.
511 The thermal driver realizes get_temp and set_trips function, which
512 are used to obtain the temperature of the current node and set the
513 temperature range to trigger the interrupt. When the input temperature
514 is higher than the high temperature threshold or lower than the low
515 temperature threshold, the interrupt will occur.
516
517endif